Industry Directory | Manufacturer
Design and manufacture of assembly fixtures
Industry Directory | Manufacturer
As a manufacturer of reflow soldering systems with convection or condensation and drying and coating systems, Rehm Thermal Systems has been producing energy-efficient manufacturing equipment for the electronics and photovoltaics.
New Equipment | Rework & Repair Equipment
BEST circuit frames come in both dry film and epoxy versions. We can produce circuit frames in 1 and 2 oz copper as well as with shiny tin or nickle gold coating. These circuit frames are microetched on the board side in order to insure better adhesi
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Used SMT Equipment | AOI / Automated Optical Inspection
Hardware composition: Ring LEDs (R, G, B) Image resolution 20µm Fixed shape, fixed substrate Single-phase power supply 100 to 240VAC ±10% The weight is below 500kg Equipment dimensions: 700W×900D×1600H mm (height
Used SMT Equipment | Soldering - Reflow
New arrival, like new condition. Proto-type, small batch LPKF Zelflow R04 Solder Paste Reflow Oven. Very minimal use. Powered up and tested. 220 - 240VAC single phase. FOB: Origin ALSO AVAILABLE: LPKF ZELPRINT LT300 BENCH TOP SOLDER PASTE PRIN
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
Career Center | Rochester, Ohio USA | Engineering,Management,Production,Technical Support
Seasoned PCB assembler / supervisor. Utilizing surface mount machines, lead inserters, wave solders, reflow ovens, wire bonders and substrate fabrication technology. Very proficient in surface mount device and plated through hole component rework. Al
Career Center | Toronto,, Ontario Canada | Engineering,Research and Development
DEBTANU BASU 40 Fountain Head Road Toronto, ON M3J2V1 (416) 514 0619 Cell: 416 258 7488 E-mail: debtanubasu@aol.com With more than six years of experience in the field of flip chip technologies seeking a challenging technical position in the field
SMTnet Express, November 24, 2022, Subscribers: 24,902, Companies: 11,662, Users: 27,575 █ Electronics Manufacturing Technical Articles Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for Sn
Heller Industries Inc. | https://hellerindustries.com/parts/448796-01/
448796-01 - Enhanced Rail ASSY, MD, 2043, CR Plated Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
| http://etasmt.com/cc?ID=te_news_industry,26963&url=_print
How many PCB classifications are there? From structure talk-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
