Industry Directory | Manufacturer
Production and distribution of metal jointing materials for electronics (solder, flux, brazing alloys, etc) Sales of nonferrous metal Export-import business
Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
New Equipment | Solder Materials
eFlux Selection: Rosin Based Flux for Lead-Free Wave Soldering NS-F850. NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum through hole fill and facilitates the solder drainage that ensures minimum bridges an
Electronics Forum | Wed Oct 12 14:13:08 EDT 2005 | Inds
SN100C is the Nihon solder. I had wave solder the board using SAC. Then had to put on solder pot, which had SN100C (nihon) solder. I think I went upto 130-135 deg C.. Let me try cooking it to 150degC Thanks
Electronics Forum | Wed May 11 19:34:42 EDT 2005 | Tom B
You may want to check out Nihon Superior. Nihon licensed their Alloy to Aim for US production Late last month! The alloy uses nickel and the solder joints look amazing for "lead-free" they rival tin-lead in appearance. Other boasts is that you can
Industry News | 2003-03-12 09:03:48.0
Demand for the material, used in PCBs, is increasing because of folding mobile phones and other devices
Industry News | 2021-02-05 09:31:21.0
The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Parts & Supplies | SMT Equipment
SOLENOID VALVE / EJECTOR / AIR CYLINDER PCS245YNBD24SP SOLENOID VALVE 14 KURODA PCS242 / DC 24V SOLENOID VALVE 23 KURODA PMS2406 / DC24V SOLENOID VALVE 3 KURODA PCS2408 SOLENOID VALVE 1 KURODA PCS245 / DC24V SOLENOID VALVE 6 KURODA AS2406 SOLENOID
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
| https://pcbasupplies.com/sn100c-lead-free-bar-solder/
by Nihon Superior Sha Co., Ltd. and its licensees*, NT100Ge is a high-quality, low-cost alternative to silver-bearing solder. The eutectic tin-copper-nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements
