Industry Directory | Manufacturer
Production and distribution of metal jointing materials for electronics (solder, flux, brazing alloys, etc) Sales of nonferrous metal Export-import business
Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
Electronics Forum | Tue Apr 29 07:12:49 EDT 2003 | Glen barden
Sn/Cu/Ni is introducted to me in wavesoldering lead free process. Around in our industry, we have a plenty of info. about SAC but not on this alloy. The distributor showed me some information about this alloy including less dross, more shiny /smoot
Electronics Forum | Fri Jul 08 10:08:12 EDT 2005 | fctassembly
Dear Hiram, Thanks for your interest in SN100C. FCT Assembly is a licensed manufacturer of SN100C from Nihon Superior for North America. We have the alloy in 5 application labs- FCT (CO), Vitronics (NH), Technical Devices (CA), Electrovert (MO), and
Used SMT Equipment | AOI / Automated Optical Inspection
Mirtec AOI MV-7XI FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D DIGITAL MULTI-FREQUENCY
Used SMT Equipment | Pick and Place/Feeders
Mirtec AOI MV-7omni Description In-Line AOI Machine FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D
Industry News | 2021-02-05 09:31:21.0
The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Industry News | 2011-08-30 19:41:37.0
The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Parts & Supplies | X-Ray Inspection
Omni-directional conductive sponge are ventilate and flexible,use for making shielding gasket,I/O gasket.Soft conductive foam EMI gaskets are ideal for applications that require conformability,excellent EMI shielding,and superior conductivity at low
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
Technical Library | 2020-07-29 20:12:52.0
Aluminum is a metal that it is hard to solder due to the high surface tension difference between it and molten solder alloy. This occurs because aluminum rapidly forms a tenacious oxide layer whenever it is exposed to oxygen in the air. The oxide layer is responsible for the high surface tension difference between the aluminum and the solder and impedes the solder from spreading evenly on an aluminum surface. There are hundreds of aluminum alloys available in the marketplace; it is important to identify the form of aluminum that is being soldered. Once this is done, an appropriate soldering technique can be chosen for soldering the specific aluminum alloy under consideration. Direct aluminum soldering eliminates using expensive plating techniques to prepare the aluminum surface for soldering.
Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html The automatic PCB magazine loader is used at the starting of the SMT production line for loading of PCBA to the line.he unit loads the production line automatically by pu
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Juarez Chapter Webinar: DFM, Design For Manufacturing
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Operator in our Lighting Manufacturing facility in Racine, Wisconsin. Location: Racine, WI Shift: 7AM - 3PM (Monday - Friday) Full-time w/benefits! Summary: This person will be a primary contribut
Career Center | San Pablo City, Laguna, Philippines | Engineering,Maintenance,Production,Sales/Marketing,Technical Support
Some key points you may find relevant to this job opportunity include: Extensive experience and knowledge on Service and Technical skills by performing Set-up, Buy-off, troubleshooting of the assigned Equipments. Provide solution to custom
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
| https://www.smtfactory.com/LED-Flip-Chip-id3680601.html
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KD Electronics Ltd. | http://www.kundasmt.com/?list_32/6016.html
Linking Conveyor (500mm & 1000mm)-NUTEK-Suzhou Feierte electronic co.,ltd-welcome to KD Electronic Categories HOME ABOUT US SURFACE MOUNT SYSTEM ASM EQUIPMENT Equipment Accessories OTHER EQP KEYSIGHT EUIPMENT Equipment Accessories DEK Foresite ERSA Scheugenpflug
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