New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
CX-411/CX-412/CX-491/CX-493/CX-424/CX-421/ CX-422/CX-423/CX-441/CX-442/ EX-31A/EX-31B/EX-32A/EX-32B EX-21A/EX-21B/EX-23/EX-29A/EX-29B/EX-22A/ EX-22B/EX-24A/EX-24B/EX-26A/EX-26B/EX-28A/EX-28B/ EX-15E/EX-17E /EX-14B/ EX-15/EX-14A EX-11A/EX-11B/EX-13
Electronics Forum | Sat Apr 21 14:50:17 EDT 2012 | edmentzer
We are using SN100C in both our wave and selective machines and have very good results. We also using it for ROHS hand soldering. It flows better than SAC305, the joints are shinny just like Sn63/37. We are looking into using SN100C as our paste b
Electronics Forum | Mon Apr 16 11:10:13 EDT 2012 | kkay
We are thinking of switching over from sac305 to sn100. Has anyone had any experience with this changeover and is there any drawbacks to switching to sn100?
Used SMT Equipment | SMT Equipment
Many Fuji Sparr parts for sales.. No Part No. Description Qty. Machine 1 GPH4580 HOLDER 7 CP43 2 MPH0472 PISTON 19 CP43 3 GPL1200 PIN 8 CP43 4 S1046A CIR-CLIP WR19 10 CP43 5 PPQ1020 PIN,LOCATING 1 CP43 6 GXT2333 HOLDER,PIN 2 CP43 7 MPA5031 COLLAR 2 C
Industry News | 2020-03-19 13:12:42.0
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Industry News | 2010-03-22 13:14:36.0
GREELEY, CO — FCT Assembly introduces its NL930PT no-clean, lead-free, halide-free pin probable solder paste. The product is unique in that it is a clear residue paste that can print down to low surface area ratios consistently. Combined with SN100C, this solder paste produces the most cosmetically appealing solder joint available on the market.
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Parts & Supplies | Assembly Accessories
104687870505 MSR/HT VS NOZZLE 104687871004 MSR/HT S NOZZLE 104687874002 MSR/HT melf M NOZZLE 104687874003 MSR/HT melf L NOZZLE 10467S0
Parts & Supplies | Pick and Place/Feeders
Panasonic nozzles available for MSH/MSR/MPAV Series MSH-2 MSH-3 and MSH G1 Nozzles Part Number Description 1018 7818 10xx-D Nozzle, S (Diamond Tip) 1023 7892 65 Nozzle, MA (Diamond Tip) 1021 2062 50xx Nozzle, M 1200 8103 50 Nozzle, L 102
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
TI New and Original SN65HVD3082EDR in Stock SOIC-8 package TI New and Original SN65HVD3082EDR in Stock SOIC-8 package TI New and Original SN65HVD3082EDR in Stock SOIC-8 package TCMD1000 VISHAY TCMT1100 VISHAY TCMT1600 VISHAY UF4007 VISHAY US
SMTnet Express, April 28, 2022, Subscribers: 25,631, Companies: 11,565, Users: 27,194 The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys The different rates of thermal expansion of the many
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
, °C ALLOY COMPOSITION, wt% PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 4 of 24 Rev Level: 1 Rev Date: 1/03/01 Eutectic Vs. Lead Free Process window comparison Conclusions
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6009.html
control unit 03052349-01 Push-in L con. w. push-in sleeve QSL-12H 03052363-01 Adjusting gauge 03052368S01 Patch cable Cat.5e FTP 15m GY 03052386S01 Pneumatikschlauch TS1209 schw.Nylon 1M 03052394-01 SN 62355 - M5x10-10.9, verz. DSP 03052428-01 WASTE SLIDE
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