New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
Electronics Forum | Tue Aug 10 20:22:15 EDT 1999 | Wayne Sanita
Hello, Could be that touchup operators are using too much flux. What are you dispensing flux with. Disposable or refillable flux pens are good to have around. | | | | hello to everybody, | | | | we have a really satisfactory no clean proc
Electronics Forum | Wed Aug 18 15:52:21 EDT 1999 | DENNIS FOWLER
| | | Gian | | | | | | You alarm me when you talk of white residues in a "no-clean" process. This should not happen. It sounds like you have compatibility problems between different residues and/or a poorly polymerised solder mask. | | | | | | Ther
Industry News | 2008-10-26 00:28:46.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dave Adams (Session Chair) of Rockwell Collins, Lee Flasche of Delphi Electronics Group, Dr. Ning-Chen Lee of Indium Corporation, Steve Hugh of Philips Medical, and Dr. Ken Dishart formerly of DuPont will present in Session 4 on Lead-Free Cleaning. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008
Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Technical Library | 2020-11-04 17:57:41.0
Residues present on circuit boards can cause leakage currents if not controlled and monitored. How "Clean is Clean" is neither easy nor cheap to determine. Most OEMs use analytical methods to assess the risk of harmful residues. The levels that can be associated with clean or dirty are typically determined based on the exposed environment where the part will be deployed. What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments. As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration.
Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon May 10 00:00:00 EDT 2021 - Mon May 10 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Manual Cleaning of Printed Board Assemblies – Step by Step Guide
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Article Return to Front Page No-Residue Technolo
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-38-clean-vs-no-clean-fluxes
: Clean vs No-Clean Fluxes Question: We are using a Kester 186 RMA Flux for our assembly process. Can you tell me if you have to clean an RMA flux and what the issues are if we do not? Possible Solution: You
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/microdrop-flux-dispenser
specific locations without overspray - Ideal for micro flux deposition of flux to small solder sites with unparalleled accuracy and minimal flux consumption - Provides true no-clean processing since flux is
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