Industry Directory | Manufacturer
A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.
Industry Directory | Manufacturer
TPB is a reliable custom packaging boxes company in the USA offering unique & stylish custom boxes with logo to reflect your brand reputation. Contact today!
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
New Equipment | Rework & Repair Equipment
Orange Sticks with double beveled ends, 7" x 5/32" (SH-83) The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not gen
Electronics Forum | Mon Jul 26 19:32:03 EDT 1999 | Steve Gregory
| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of
Used SMT Equipment | THT Equipment
Hello and thank you for your interest in our GPD CF10 Radial Lead Formers For Sale. We have 2 units available in very good condition. Included are some dies and manuals. We will split up and sell individually. We can package and ship overseas
Used SMT Equipment | THT Equipment
Hello and thank you for your interest in our GPD CF9 Radial Lead Formers For Sale. We have 2 units available in very good condition. Included are some dies and manuals. We will split up and sell individually. We can package and ship overseas.
Industry News | 2023-03-30 22:45:02.0
Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Parts & Supplies | Component Packaging
1.Product name: Panasert ai parts 2.Original: China 3.Model No.:1366028S Brand Name: Lead screw-b set 1.Product name: Panasert ai parts 2.Original: China 3.Model No.:1366028S Brand Name: Lead screw-b set This company specialized
Parts & Supplies | Pick and Place/Feeders
FUJI - NXT Feeder cart Holder part no L type Wholesales price of smt spare parts, weclome to inquiry! Lead time: 2-4 working days
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2019-06-05 11:11:06.0
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Events Calendar | Tue Apr 25 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Shanghai, China
SMTA China East Conference
Career Center | San Jose, California USA | Research and Development
Join this team focused on RF Modules for the rapidly expanding Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Wireless Semiconductor Division (WSD) of Avago T
Career Center | Palmdale, California USA | Production
Help Senior Systems Technology be a leader in the contract manufacturing industry by acting as the Senior Process Engineer Responsible for leading the development, deployment and improvement of Surface Mount Technology (SMT) related processes. Identi
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF9-Doc-Package-901-1-01.pdf
CF9 Documentation Package Documentation Package for CF-9 Taped Radial Component Lead Former PN 901-1-01 CONTENTS of CF-9 Documentation Package Operating Guide In addition to installation, set up, and
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11927753-kingfei-smt-production-line-automatic-no-clean-lead-free-solder-paste-heater.html
KingFei SMT Production Line Automatic No Clean Lead Free Solder Paste Heater Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
