Electronics Forum | Mon Apr 24 20:02:38 EDT 2006 | evsint
Why don't you guys look at the "WORLD LEADERS IN SOLDER RECOVERY". EVS International make the EVS 3000 and EVS 6000 Solder Recovery Systems. Many other companies have tried to come up with different ways of recovering solder but the EVS is the best
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
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