New Equipment | Rework & Repair Equipment
A Simple, Low Cost Solution to Damaged Circuitry PACE Cir-Kit Circuitry Repair Kits are a simple, low cost solution to damaged, lifted or missing circuitry on pc boards, allowing fast repair and modification per IPC 7721. Non-ThermoBond Cir-Kits are
New Equipment | Rework & Repair Equipment
A Simple, Low Cost Solution to Damaged Circuitry PACE Cir-Kit Circuitry Repair Kits are a simple, low cost solution to damaged, lifted or missing circuitry on pc boards, allowing fast repair and modification per IPC 7721. Non-ThermoBond Cir-Kits are
Electronics Forum | Sat Apr 18 10:29:47 EDT 1998 | Steve Gregory
| Have mixed technology board and am interested to hear any info on the Nordson non-contact adhesive dispenser. | I woud appriciate any feedback I could get. I am currently using a contact system and am tired of breaking needles and need a way to spe
Electronics Forum | Tue Sep 22 20:08:58 EDT 1998 | Dave Brand
Rick: I'd be happy to give you information on the system benefits and limitations. I work for Asymtek so please email me back so we can talk off-line. Thanks. -Dave Brand | | | Have mixed technology board and am interested to hear any info on the No
Used SMT Equipment | Pick and Place/Feeders
70 position removable IQ ( Intelligent ) Surface Mount Tape Feeder Base for QUAD Q series pick and place machines. The detachable base will work with intelligent IQ software that can access information on individual feeders and locate feeders on the
Industry News | 2009-04-23 20:54:01.0
MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Parts & Supplies | Pick and Place/Feeders
SM FEEDER INDEXING SENSOR J9065157A & J9065211A SOLINOID VALVE J6702045A FEEDER IT Slaver board J9060366A SP400II CPU Board CP 56mm Feeder FEEDER TAPE GUIDE ASS'Y J8100123A FEEDER VINYL GUIDE ROLLER J2500104 FEEDER STEEL BALL J1301155
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Yamaha Machine: YV100II Part Name: Main Stopper Cylinder Part Number: KG7-M9165-00X Condition: Original New Leadtime: 3days Yamaha YV100II Main Stopper Koganei Cylinder KG7-M9165-00X Original New Detail Inf
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
ORION Industries | http://orionindustries.com/pdfs/silpad400.pdf
. Sil-Pad 400 actually improves its thermal resistance with age. The reinforcing fiberglass gives excellent cut-through resistance and Sil-Pad 400 is non-toxic and resists damage from cleaning agents
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-adhesive-application.php
. Using fluid beyond pot life can result in variable dispense results. Conductive Adhesive & Non-Conductive Adhesive Dispensing When dispensing conductive and non-conductive adhesives, we recommend using either our Precision Auger Pump or our Jet Pump , depending on application
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
