2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
New Equipment | Selective Soldering
For flexible miniwave soldering processes and dip soldering processes that guarantee short cycle times. The high-end system which leaves nothing to be desired. Maximum Power for Your Selective Production. SEHO PowerSelective is featured with an ou
Electronics Forum | Wed Apr 21 21:50:28 EDT 2004 | adam
Hi I recently having problems on the components having non wetting on the flex circuits. The profile that I am using is according to the solder paste suppiler recommended. Can anyone pls. advise? Regards
Electronics Forum | Wed Sep 15 20:59:23 EDT 2010 | genesan
hi All, Here i snap shot previous PCB(HASL) and current PCB(Immersion Silver).Base on the photo it could be PCB oxidize cause the non wetting?
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Used SMT Equipment | SPI / Solder Paste Inspection
The LSM300 follows the successful Laser section Microscopes LSM and LSM2. This new non-contact laser based system is an off-Line solder paste inspection system.LSM300 provides automatic height measurements, eliminating the inconsistencies of manual m
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | Javalera, Gen. Trias, Cavite Philippines | Engineering
Numonyx is a semiconductor company making flash memories, which was founded on March 31, 2008 by Intel Corporation, STMicroelectronics and Francisco Partners. The company supplies non-volatile memory for a variety of consumer and industrial devices i
SMTnet Express, November 19, 2017, Subscribers: 30,938, Companies: 10,768, Users: 23,942 To Quantify a Wetting Balance Curve Frank Xu Ph.D., Robert Farrell, Rita Mohanty Ph.D.; Enthone Wetting balance testing has been an industry standard
ASCEN Technology | https://www.ascen.ltd/Video_Channel/Non-standard_equipment/510.html
Blog Solution machine News PCB conveyor system Video Channel PCB conveyor transporter PCB depaneling machine PCB loader unloader Non-standard equipment Component lead former Component insertion feeder
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection
. The solder joint is confirmed as ‘non-wet open’ and as a result this would have significant impact on its integrity, and ultimately the integrity of the BGA device and the product it ends up in
