Industry Directory | Manufacturer
We will meet your requirements as follow: Through hole component soldering RoHs-Non-RoHs wire soldering, Alcohol Cleaninig facility as per customer requirement* ESD Bag Packing as per customer requirement* Box Building Job work
Industry Directory | Manufacturer
Selective Soldering Equipment and Solutions for Printed Circuit Board Assembly
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Rework & Repair Equipment
Orange Sticks with double beveled ends, 7" x 5/32" (SH-83) The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not gen
Electronics Forum | Wed Feb 09 08:54:42 EST 2000 | pascal MATHIEU
Hello friends , in order to try to reduce our labour cost , we are thinking to replace manual placementof PTH COMPONENTS by automatic unit which 'll be able to place relays ,and connectors . is there anybody on this forum to advise us on this topi
Electronics Forum | Wed Feb 09 09:54:50 EST 2000 | JAX
Trying to place PTH components with an SMT machine is possible but maybe not plausible. Would you have to buy specialized tools and equipment for the job ( gripper nozzles ). Are the machines you have capable. i.e.. Would you need camera modification
Used SMT Equipment | Soldering - Wave
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the features an
Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2016-08-25 17:56:34.0
GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA
X-Ray of PCBs Webtorial
Career Center | Santa Cruz, California USA | Production,Quality Control
Soldering Technician, Touch-up for PCBAs Perform hand soldering and touch-up rework for Printed Circuit Board Assemblies (PCBA), cables and associated equipment. Inspect PCBA for defects, loose connections, missing components. Solder to perform r
Career Center | Lititz, Pennsylvania USA | Engineering
Provides advanced engineering expertise in support of the design, and integration of highly complex circuit card assemblies. Technical expertise should include a broad background in circuit card assembly with a strong concentration in surface mount
Career Center | San Pablo City, Laguna, Philippines | Engineering,Maintenance,Production,Sales/Marketing,Technical Support
Some key points you may find relevant to this job opportunity include: Extensive experience and knowledge on Service and Technical skills by performing Set-up, Buy-off, troubleshooting of the assigned Equipments. Provide solution to custom
Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
! Pin In Hole Intrusive Reflow P
Blackfox Training Institute, LLC | https://www.blackfox.com/tag/through-hole-soldering-training/
: Through Hole Soldering training You are here: Home Entries tagged with "Through Hole Soldering training" Make IPC Training Part Of Your 2021 Plan Blog , News
| https://www.eptac.com/faqs/ask-helena-leo/ask/piggy-backing-of-melf-components-non-glass
Piggy Backing of MELF Components (non-glass) - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
