Industry Directory: non-conductive via fill (10)

Bare Board Group

Industry Directory | Consultant / Service Provider / Manufacturer

BBG will service your quick turn prototype, your small volume run as well as your full production requirement. We have plants dedicated to quick turn, small volume and prototype applications.

Uniwell (HK) Electronics Co.,ltd (uwellpcb.com)

Industry Directory | Manufacturer

UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly

New SMT Equipment: non-conductive via fill (30)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: non-conductive via fill (190)

conductive fill via

Electronics Forum | Mon Nov 11 02:28:27 EST 2002 | Melvin

I want to make a double-sided PCB. the process include conductive filling via for RF guarding. Does anyone can tell me where I can do it?

conductive fill via

Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef

Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa

Used SMT Equipment: non-conductive via fill (6)

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Used SMT Equipment | Board Cleaners

Speedline Electrovert Aqueous Cleaning System In-line Cleaner Model: Aquastorm 200 (Torrid Zone) Year: 2004 S/N 480409 Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray manifolds Valve switching to div

Tekmart International Inc.

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Used SMT Equipment | Board Cleaners

Speedline Electrovert Aqueous Cleaning System Brand: Speedline Model: Aquastorm 200 (Torrid Zone) Serial #: 480409 Year: 2004 Type: In-line Cleaner Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray m

Tekmart International Inc.

Industry News: non-conductive via fill (96)

GPD Global to Focus on PCD Dispensing at ATX West 2011

Industry News | 2011-01-12 17:48:44.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

GPD Global

GPD Global to Promote PCD Dispensing at the SMTA Dallas Expo & Tech Forum

Industry News | 2011-02-04 01:47:14.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.

GPD Global

Technical Library: non-conductive via fill (18)

Dam and Fill Dispensing for Medical

Technical Library | 2023-08-16 18:02:27.0

One of our customers in the medical industry requested dam and fill application testing on a Kapton substrate. The material needed to be non-conductive for dispensing around electrical components, acting as structural support. Ultimately the product will be folded, therefore the footprint had to be small.

GPD Global

Via In Pad - Conductive Fill or Non-Conductive Fill?

Technical Library | 2020-07-15 18:29:34.0

In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.

Advanced Circuits

Videos: non-conductive via fill (26)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Training Courses: non-conductive via fill (3)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

Events Calendar: non-conductive via fill (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: non-conductive via fill (2)

Regional Sales Manager

Career Center | , Florida USA | Sales/Marketing

Multinational Florida-based company seeks dynamic sales professional to fill the position of Regional Sales Manager. The qualified individual will have a strong background in electronic manufacturing services and sound knowledge of the electronic co

Personnel Concerns, Inc.

SMT Operator/AOI Operator

Career Center | Phoenix, Arizona USA | Production,Quality Control

Growing contract electronic manufacturer seeking to fill multiple positions: SMT Operator/Programmer Individual will determine and specify, revise and/or review, the most economic methods, operation sequence and tooling for the fabrication of pri

Triad Electronic Technologies

Career Center - Resumes: non-conductive via fill (5)

Jerry McBeth Resume

Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development

Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Express Newsletter: non-conductive via fill (203)

SMTnet Express - July 16, 2020

SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular

SMTnet Express - June 27, 2019

SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key

Partner Websites: non-conductive via fill (939)

PCB Libraries Forum : PCB Via Terms and Applications

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-via-terms-and-applications_topic1596.xml

: There are two types of via filling Non ConductiveConductive Conductive Fill: generally, a conductive filled via will be used when heat or a large amount of current needs to be carried from one side of the board to another

PCB Libraries, Inc.

Conductive Adhesives | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/conductive-adhesives

Conductive Adhesives | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets

ASYMTEK Products | Nordson Electronics Solutions


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PCB Handling with CE

Smt Feeder repair service centers in Europe, North, South America
Void Free Reflow Soldering

We offer SMT Nozzles, feeders and spare parts globally. Find out more
High Throughput Reflow Oven

Wave Soldering 101 Training Course
SMT feeders

High Precision Fluid Dispensers
Circuit Board, PCB Assembly & electronics manufacturing service provider

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.