Industry Directory | Manufacturer
Ircon is a leading manufacturer of thermal imaging equipment, infrared thermometers, and pyrometers. We specialize in non-contact temperature measurement. www.ircon.com
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
SEC Industrial Linear Accelerator LINASEC® Linear Accelerator equipment is designed for use as a syringe for non-destructive testing in specific applications and cargo and vehicle inspection at ports and borders. LINASEC® equipment is an all
Industry News | 2015-01-07 15:52:18.0
The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2019-05-31 08:50:57.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
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SMTnet Express, January 26, 2023, Subscribers: 24,669, Companies: 11,705, Users: 27,703 █ Electronics Manufacturing Technical Articles Non-Destructive Test Methods Failure analysis (FA), by its very nature, is needed only when things
SMTnet Express, May 19, 2022, Subscribers: 25,528, Companies: 11,568, Users: 27,231 Electronics Manufacturing Technical Articles Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/aerospace?con=t
functions that are required across a wide range of areas. Nordson DAGE bondtesters provide the accuracy that is essential for both destructive and non-destructive mechanical test evaluation to be performed in a repeatable manner, for both the development of
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments" 2014: Jie Gong, Ph.D., Georgia Institute of Technology "Non-Destructive Evaluation of Solder Bump Quality under Mechanical Bending Using Laser Ultrasonic Technique" ^ Hide ^ Premium
