Industry News | 2013-03-18 10:28:43.0
SEHO Systems GmbH,will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity If you don't see images, please visit online version at #Application.SmtNet.baseURL#/express/ The Impact of Reflowing A Pb
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
hands-on experience of solderability testing of different solder finishes and assessment of results. Using the instructor’s unique video material many process faults will be demonstrated. In process testing non laboratory testing is illustrated as well as
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