Type no. K-MA8835 Heating parameters Number of heating zones On 8 August Length of heating zone 2850mm Heating mode Hot air Number of cooling zones 1 Send some parameters
New Equipment | Board Handling - Conveyors
American SMT Assembly line Wave soldering machine in feed conveyor Factory Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:Approx.45Kg Product description: American SMT Assembly line Wave soldering machine
Electronics Forum | Fri Mar 27 17:26:36 UTC 2026 | SMTA-74487602
Curious what everyone is using in terms of their reflow profiler. I've used KIC and ECD and liked KIC way better due to the predictive features that helped you optimize your profile. Was recently at APEX and saw SolderStar and was pretty impressed
Used SMT Equipment | Screen Printers
Brand New in Box Dek 265 12 Volt Power Supply. DEK part# 112527, Hitron Model# HSH180C-11(S). For any questions please contact 4Tech Electronics at 313-532-9400 or 4TechUSA.com
Used SMT Equipment | Pick and Place/Feeders
Fuji CP6 8x4 Feeder Embossed Brand New never been used. 3 Available. For any questions please contact 4Tech Electronics at 313-532-9400 or visit 4TechUSA.com
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2023-03-30 22:45:02.0
Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
I.C.T Technical Support for PCBA Router Machine to Electronic Consumer Product Manufacturer in the Philippines Explore how I.C.T Technical Support is revolutionizing the electronic manufacturing industry in the Philippines by optimizing PCBA Route
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Mon Apr 20 18:30:00 UTC 2020 - Wed Apr 22 18:30:00 UTC 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Mon May 16 18:30:00 UTC 2022 - Wed May 18 18:30:00 UTC 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Portland, Maine USA | Sales/Marketing
Beau Tech, a manufacturer of hand tools for the electronics industry and hobby market is seeking a Sales Representative in Europe. Responsibilities include: Set up distributors in the European market. Promote product line through trade shows, etc.
Career Center | Northern region, Mexico | Engineering
STI Electronics, Inc. is looking for a contract technical instructor located in the northern region of Mexico with 3-5 years experience in teaching IPC and electronics assembly related courses. Hands on experience in manufacturing, soldering, cabl
Career Center | Dehradun, uterakhand India | Research and Development
• Languages: ASSEMBLY LANGUAGES (8051,8085, 8086), FUNDAMENTALS OF C • Designing Software known: MULTISIM, Project Navigator (VHDL), Mat Lab, PCB Designing, PLC & SCADA, NI VDM- 2009 and NI Lab View- 2009. Area of Interest • Embedded System • M
Career Center | , Dongguan China | Engineering,Management,Production,Purchasing,Quality Control
Candidate has 7 years of multi-disciplinary, global experience in Quality and Manufacturing Engineering, within OEM and Electronics Manufacturing Services (EMS) business sector (including P and L responsibility for Plastics injection facility, Metal
SMTnet Express, June 24, 2021, Subscribers: 26,990, Companies: 11,385, Users: 26,722 Filling of Microvias and Through Holes by Electrolytic Copper Plating — Current Status and Future Outlook The electronics industry is further
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/
Electronics in Harsh Environments Conference Menu + Home Conference Technical Program Professional Development Course Exhibit
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/whats-new-in-electronics-live-2017
What's New in Electronics LIVE 2017 ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
