We are a student group at Brown University working to build a low-cost, open-source CubeSat, EQUiSat.
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Cleaning Equipment
DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative
Electronics Forum | Mon May 22 09:35:07 EDT 2017 | emeto
There is one lead that is a total miss. I think you are too low with the wave there - you are barely touching the board. I would say first look at your wave height. If you have the possibility to change the angle of the wave(if there is a backplane t
Electronics Forum | Mon Jun 05 18:50:10 EDT 2017 | caurbach
Hi Zac, My 2 cents: We had similar problems on a board in the same situation (tin-lead HASL, very long leads, low pot height, high pump RPM). Trimming the leads shorter, moving the pot closer to the board, and dropping the pump speed down to sane
Used SMT Equipment | General Purpose Test & Measurement
Keithley 6485 Picoammeter combines Keithley's expertise in sensitive current measurement instrumentation with 5-1/2 digits, enhanced speed, and robust design. With eight current measurement ranges and high speed autoranging, this cost-effective instr
Used SMT Equipment | In-Circuit Testers
Ando AQ6315E Optical Spectrum Analyzer The AQ6315E optical spectrum analyzer (OSA) is an improved version of the well known Ando AQ6315A. This OSA can do spectrally resolved intensity measurements in the range of 350 to 1750 nm with a wavelengt
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2010-08-25 14:48:18.0
IPC — Association Connecting Electronics Industries® announces a new automated testing feature now available for purchasers of IPC electronics assembly DVD or OVT (Online Video Training) products. Automated testing can be used in conjunction with any of IPC’s extensive library of electronics assembly training videos, verifying understanding in key subject areas.
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Technical Library | 2016-01-07 19:13:23.0
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and electroless copper plating. PTFE is widely used in many industries because of its unique electrical, thermal, and mechanical characteristics. However, because of its low surface energy, it is difficult to acquire enough adhesion strength between PTFE and other substances without surface modification. Plasma is well known as one of the surface modification techniques that improve adhesion strength.
FKN Systek K1000 - Economical Manual and Motorized Depaneling of Pre-scored PCBs Blades Made of Long Lasting High Speed Steel.. Singulate Panels with Components up to 2.5" Adjustable front blade guard for correct scoreline input. Optional Work
FKN Systek K2000 - Reduce scrap due to board handling Issues Economical Manual and Motorized Depaneling of Pre-scored PCBs Blades Made of Long Lasting High Speed Steel.. Singulate Panels with Components up to 2.5" Adjustable front blade guard
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/ultralow.pdf
Ultra Low II the probability that air will be drawn into the oven against the current of escaping nitrogen. The velocity of the exiting nitrogen is governed by the simple relationship: M=VxAxD where M= mass flow, V= gas velocity, A
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/949839602307-nozzle-catch-low-lane-181950?page=787&order=name+asc
.949839602307 /shop/949839602307-nozzle-catch-low-lane-181950 ¥ 0.00 0.0 CNY ¥ 0.00 ¥ 0.00 This combination does not exist. ADD TO CART Inquiry Now
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