Industry Directory | Manufacturer
We are in 'ELECTRONIC CONTRACT MANUFACTURING' having 6 SMT lines & 2 production set-up in India. We are populating all type of Through Hole & SMD components including fine pitch,QFP & BGA. We are ISO 9001:2000 certified company.
Industry Directory | Consultant / Service Provider
Specialised in Prototyping Assembly/Rework
The ScanCOMPONENT Product helps in creating vision files for your placement machines. It is its own standalone product or a module within the ScanINSPECT VPI product. ScanCOMPONENT is a PC-based offline component programming system for the creatio
Samsung SM481 Chip Mounter Samsung SM481 Chip Mounter Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Samsung SM481 Chip Mounter INQUIRY samsung SM481 chip mounter Products Desc
Used SMT Equipment | Repair/Rework
Madell BGA rework station The SMD-BGA rework station includes integrated programable infrared reflow for accurate profile control, high precision optical split vision system, x-y-θ adjustable platform, bottom preheat. No need to change hot air nozzl
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine 210 is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0402、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision pos
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
ScanCOMPONENT is a PC-based offline component programming system for the creation of vision data files from the smallest flip chip and bumped packages to the largest odd form devices. The ScanCOMPONENT is a standalone Product as well as a module of
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | San Jose, California USA | Engineering,Management,Research and Development
Ph.D., MBA, senior technical & management experience, advanced technology, electronics manufacturing processes, packaging, miniaturization, reliability, global team, PWB assembly, soldering Experience: 2001 - Flextronics, San Jose, CA Senior Manage
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. The lateses processes, materials, equipment and techniques for rework of BGA, QFN, LGA, PoP and other SMD components. Key Topics Include: A review of the parameters for establishing a safe thermal profile
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