Industry Directory: nsop ball bump (2)

BGA Bumps

Industry Directory | Manufacturer

Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale

SIPAD Systems Inc.

Industry Directory | Manufacturer

The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.

New SMT Equipment: nsop ball bump (10)

BGA IC Reconditioning

New Equipment |  

Recondition and Re-ball BGA IC's

BGA Bumps

Tacky Assembly Flux

Tacky Assembly Flux

New Equipment |  

Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and

Hallway International Trading Co.,Ltd.

Electronics Forum: nsop ball bump (62)

Re: Void in solder bump

Electronics Forum | Fri Jan 15 08:11:34 EST 1999 | Jim Nunns

Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK Regards Jim |

Re: Void in solder bump

Electronics Forum | Fri Jan 15 15:29:03 EST 1999 | Jason Hall

| Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | Regards | Ji

Used SMT Equipment: nsop ball bump (1)

Dage Series 4000 Bondtester

Dage Series 4000 Bondtester

Used SMT Equipment | Semiconductor & Solar

Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull

Fix Trade BV

Industry News: nsop ball bump (71)

Pac Tech USA Offering Contract Wafer Bumping, Stencil Services

Industry News | 2003-01-27 10:27:31.0

At a New Facility Within the Company's U.S. Headquarters

SMTnet

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

Technical Library: nsop ball bump (3)

High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives

Technical Library | 2018-04-05 10:40:43.0

The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.

YINCAE Advanced Materials, LLC.

Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components

Technical Library | 2021-04-21 15:10:16.0

Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.

Auburn University

Videos: nsop ball bump (3)

CBP Jaw Cleaner (contactless cavity cleaner)

CBP Jaw Cleaner (contactless cavity cleaner)

Videos

During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball cavities can be damaged easily. XYZTEC ha

XYZTEC bv

NF120(200 nano resolution) X-ray Inspection System

NF120(200 nano resolution) X-ray Inspection System

Videos

#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application

SEC

Training Courses: nsop ball bump (3)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Career Center - Jobs: nsop ball bump (1)

Mid-Atlantic Regional Sales Manager

Career Center | Philadelphia, New Jersey USA | Sales/Marketing

LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e

Electronics Search Group of MRI

Express Newsletter: nsop ball bump (181)

SMTnet Express - April 5, 2018

SMTnet Express, April 5, 2018, Subscribers: 30,982, Companies: 10,916, Users: 24,587 High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced

Partner Websites: nsop ball bump (810)

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf

. 5 Side view schematic of solder spread on Cu; D: solder bump spread diameter post reflow; H: solder ball height post reflow. IV. RESULTS AND DISCUSSION A. Oxide removal agent wetting analysis As shown in Fig. 5, solder ball spread diameter (D) and

Heller Industries Inc.

PCB Libraries Forum : Collapsing vs: Non-Collapsing BGA Balls

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_collapsing-vs-noncollapsing-bga-balls_topic1868.xml

:44amNon-collapsing BGA's normally are 0.50 mm pitch or less. There are various Chip Scale Packages where the mfr. calls the package a BGA but instead of a Ball there is only a bump

PCB Libraries, Inc.


nsop ball bump searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next
Electronics Equipment Consignment

High Precision Fluid Dispensers
PCB Handling Machine with CE

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications
Selective soldering solutions with Jade soldering machine

High Resolution Fast Speed Industrial Cameras.