Electronics Forum | Wed Oct 11 09:55:10 EDT 2000 | Ian Harrison
Some boards that are populated by one of our subcontractors are getting a white powdery residue forming on them. I think it is the non clean flux and process which they are using that is causing the problem. Their process is as follows. Flux is put i
Electronics Forum | Mon Dec 10 13:56:51 EST 2001 | slthomas
1) The additional activity of the OA flux probably took care of the oxydation. How do you plan on taking care of the presence of conductive and corrosive residues from it now, though? You're not supposed to wash those parts with water. 2) The tomb
Industry News | 2017-09-04 16:39:34.0
The cleaning experts at MicroCare Corp., the industry’s leading manufacturer of critical cleaning, coating and lubrication products, will showcase their family of cleaning products at SMTA International in Illinois from 17-21 September. For 2017, the company is focusing on their newest electronics cleaner, Tergo™ High Performance Flux Remover.
Industry News | 2010-09-14 17:39:54.0
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, will display its AQUANOX® A4703 Neutral pH Aqueous Cleaning Chemistry in booth 315 at the upcoming IMAPS 43rd International Symposium on Microelectronics.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
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