New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Wed Oct 28 04:02:10 EDT 2009 | lococost
solderresist has a big offset?
Electronics Forum | Sun Apr 21 11:59:07 EDT 2002 | martino
i don't know the extra cost associated with buying the comps on reels. But my suggestion would be to calculate the how much time is been wasted 'fiddling' about with these inferior tubes, and then offset this with the extra cost of been supplied with
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG KY8030-2 3D SPI The World's Best-selling Full 3D Solder Paste Inspection Best-in-class measurement accuracy and inspection reliability Solves shadow problems by utilizing 2-way projection Provides accurate inspection data with real-time P
Used SMT Equipment | SPI / Solder Paste Inspection
Agilent SP50 Series II 3D SPI 3D Solder Paste Inspection System Model: SP50 Series II Vintage: 2006 Maximum board size: 510 by 510 mm (20 by 20 in) Minimum board size: 50 by 50 mm (1.97 by 1.97 in) Maximum board thickness: 4 mm (0.16 in) 2D an
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Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2015-04-29 03:48:39.0
SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process 3D inspection on the assembly line. SPI systems measure the height and volume of the solder pads before the components are applied and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to the SPI measurement is the accuracy of the height measurement because that has a direct correlation with solder volume and defects.
Technical Library | 2008-10-29 18:45:53.0
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
Career Center | Sta. Rosa, Philippines | Maintenance,Production,Technical Support
Complete knowledge in smt,aoi and reflow. 11 years working experienced in production and 5 years experienced in the field service job.
Career Center | Sta. Rosa, Manila Philippines | Technical Support
I am in the field of smt equipment for 15 years already and at present i am working as a Service Engineer for High Speed mounter machines . Our Company is solly Sales & Service providers of all pcb assembly and semiconductor equipment. I do inter
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/scrap-housing-assy-offset-scrap-housing-assy-offset-189190?page=141&category=1111&order=list_price+desc
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