Industry Directory | Consultant / Service Provider
Lead Conditioning, Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing Services
New Equipment | Education/Training
This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the
Bonding chip and Silicone dispensing on the PCB board
Electronics Forum | Fri Dec 07 13:15:45 EST 2001 | slthomas
We've experienced similar problems with film caps, specifically Panasonic's parts that are alledgedly compatible with both reflow and wave soldering. They are identified with either GB or JB p/n suffixes, which become either GX, GC, or JC for the ref
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Industry News | 2011-08-24 22:37:23.0
The SMTA announced that it will hold sessions and a tutorial on Package-on-Package (PoP) surface mount stacking at their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Parts & Supplies | SMT Equipment
SMT parts JUKI 2010 2020 2030 Z SLIDER SHAFT ASM E30507290A0 use on JUKI Pick and Place Machine Specifications: Brand Name JUKI Z SLIDER SHAFT Part number E30507290A0 Model Number Ensure Test in machine confirmation Guarantee One month u
Parts & Supplies | Chipshooters / Chip Mounters
There is stock for sale. If you are interested, please contact us for a quotation by email. Email: info@qosmt.com
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
Mx400L has an IPC 9850 speed of 42,000 CPH. It will accomodate a PCB size up to 26.77" x 18.11", it has 6 module heads on the front gantry, 6 module heads on the rear gantry. minimum lead pitch is 15mil, and it will place parts down to 01005 (0402 me
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic940&OB=ASC.html
Cannot Edit Pin Numbers on Chip Array - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Cannot Edit Pin Numbers on Chip Array
Lewis & Clark | https://www.lewis-clark.com/product-tag/chip-shooters/
Chip shooters Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark, Inc
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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