Industry Directory | Consultant / Service Provider / Manufacturer
SolderStar produce thermal profiler solutions for reflow soldering, selective solder machine profiling and wave solder optimization.
Industry Directory | Consultant / Service Provider / Manufacturer
Unique "Free to use" Software that optimises the efficiency & quality of Prototype PCB assembly & inspection, significantly reducing overall cost & increasing customer productivity, capacity & profitability.
DEK Horizon 02i Automatic Screen Printer Dek Horizon Repeatability: 1.6 Cpk @ 25µm Cycle time: As fast as 10 seconds Setup time less than 10 minutes Changeover time: less than 2 minutes Optimised Printer Frame common to all Horizon machines Accept
ProDEK is an innovative and high performance closed loop system tool designed to ensure optimisation of the printing performance. Communicating between the DEK screen printer and solder paste inspection machine to identify any potential problems, Pro
Used SMT Equipment | Screen Printers
DEK Horizon 02i Automatic Screen Printer Dek Horizon 02 Specifications: Dek Horizon Repeatability: 1.6 Cpk @ 25µm Cycle time: As fast as 10 seconds Setup time less than 10 minutes Changeover time: less than 2 minutes Optimi
Used SMT Equipment | Screen Printers
HORIZON 02i Approx. Weight 820kg boxed 677kg unboxed Approx. Dimensions 2060mm x 1500mm x 1570mm (81.1” x 59” x 61.8”) Accuracy and Repeatability 1.6 Cpk @ +/- 25 m Cycle Core Time 12 seconds Max. Board Size (Print Area) 508mm (X) x 508mm (Y)
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
Atom is the new flagship Europlacer pick & place platform. While it sits at the top of our range, it is complementary to and compatible with all our other platforms. That’s what Europlacer customers have come to expect. And Atom continues to deliver
FactoryLogix is an integrated suite of software modules and devices that bring speed, control and visibility to your manufacturing operations. To learn more visit www.aiscorp.com
Events Calendar | Thu Oct 05 18:30:00 UTC 2023 - Thu Oct 05 18:30:00 UTC 2023 | Monterrey, Mexico
Mexico Technology Day 2023 - ViTrox's Tech Insights & Product Demo
Career Center | Anaheim, USA | Engineering
General Manager & VP, PG Drives Technology, Inc Company Outline PG Drives Inc is the North American sales, service and distribution subsidiary of PG Drives Ltd, a leading global designer and manufacturer of sophisticated electronic motor control s
Career Center | County Durham, United Kingdom | Engineering
I am currently working on behalf of a Global Leader in Automotive Safety Systems based in the County Durham area of the UK. They are currently seeking to recruit an SMT Engineer whose main duties and responsibilities will compromise of the following
Career Center | Bangalore, Karnataka India | Engineering,Management,Production,Technical Support
1)Preparing project schedules / plans, engineering designs / drawings and technical specifications for smooth execution of projects. 2)Project study, estimation & Quote preparation. 3)Factory costing for volume manufacturing. 4)Turn Around Time(TAT)
Career Center | Singapore, Singapore | Engineering,Production
I have 13years of experience in SMT field, my primary duty is to co-ordinate new product introduction and perform pilot run in process related such as machine programming from solder paste application to pick and place machine, also daily improvement
Placement Optimisation in a Lean Manufacturing Environment Placement Optimisation in a Lean Manufacturing Environment Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce
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. To do this slew parameters should be optimised to enable the spindles to drive at maximum speeds through much of the Z move before decelerating
| https://www.feedersupplier.com/sale-13118502-6-sigma-0-1mm-fiducial-capture-dek-horizon-03ix-smt-screen-printer.html
• Best-in-class print platform with future proof advantage • Optimised printer frame technology and retrofittable productivity tools and options 6 sigma performance Machine capability 2 Cpk
