Electronics Forum | Thu Jul 20 16:45:54 EDT 2000 | Darby
Good morning Bob. Darby from Australia here. We sometimes see an orange peel type finish on our reflow solder joints when viewed under the microscope. Any ideas on what causes this ? Should I worry about it. I use a straight rise profile ( no "platea
Electronics Forum | Thu Jul 20 17:10:11 EDT 2000 | Darby
It's six in the morning here! Give me a bell the next time you are out here and I'll take you fishing on the sensational Sydney Harbour. However I will not be getting out of the boat and "diving" - too many noahs arks. I'll leave that to the daredevi
Industry News | 2019-10-02 16:32:48.0
Nordson ASYMTEK is pleased to introduce its Panorama™ conformal coating line solutions, providing a balance of equipment and process control for optimal efficiency in automated conformal coating.
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
Technical Library | 2024-09-02 21:02:46.0
In conformal coating, there are several mechanisms that cause failure of printed circuit boards (PCBs). In a series of technical bulletins SCH will examine the common failure mechanisms in conformal coating including capillary flow, delamination, cracking, loss of adhesion, dewetting, corrosion, orange peel, pinholes, bubbles and foam.
Technical Library | 2021-08-11 01:00:37.0
Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/PBFT-VS-SPC-User-Guide-20041102-PBT-002_CD-FORCEWare-v3-3.pdf
Peel Back Tester Guide PBFT VS SPC User Guide for Peel Back Force Tester with SPC Capability November 2, 2004 Document part no
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
connections, die mounting & more Inspection and process defect Our webinar is FREE to join but we do ask attendees to consider contributing a small amount to our chosen charities Mind – Better Mental Health https://www.mind.org.uk/donate Marie Curie
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