Specializing in manufacturing pH, ORP & Ion Selective sensors for difficult process control aplications. Offering a full line of process control instrumentation.
New Equipment | Cleaning Equipment
Fully automatic online PCBA cleaning machine-SMS-6300 Fully automatic online PCBA cleaning machine-SMS-6300 1. On-line, large-volume PCBA cleaning system. 2. Large-flow cleaning method can effectively remove organic and inorganic pollutants such as
New Equipment | Cleaning Equipment
Circuit Board PCBA Washing Machine PCBA Cleaning Equipment 380V Power Supply Description: This machine is an integration of high-end cleaning machine,with energy-saving environmental protection, bulk cleaning, it can complete the cleaning, rinsin
Electronics Forum | Wed May 23 11:32:13 EDT 2001 | kmorris
I beleive it's Organic Acid
Electronics Forum | Thu Aug 24 13:13:42 EDT 2000 | Dr. Ning-Cheng Lee
Inductive effect is the electron attraction force between chemical moieties. Inductive effect in flux activator would stabilize the dissociated organic acid, thus enhance the acidity, therefore increase the flux activity.
Industry News | 2025-12-05 01:07:10.0
In 2025, Heller Industries proudly marks its 65th anniversary, a milestone that reflects our enduring commitment to innovation and customer success.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2023-04-17 21:37:32.0
Ionic contamination is a leading cause in the degradation and corrosion of electronic assemblies, leading to lifetime limitation and field failure (Fig. 1). Ionic residue comes from a variety of sources shown in Fig. 2 opposite: Examples of ionic contaminants: * Anions * Cations * Weak Organic Acid
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
Unsurpassed cleaning, high-efficiency drying, low cost of ownership, ease of maintenance, and minimum downtime all come together in the ELECTROVERT Aquastorm, a world-class printed circuit board cleaning system. As high-reliability PCBs become minia
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, May 10, 2018, Subscribers: 31,023, Companies: 10,930, Users: 24,698 Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards Haley Fu, iNEMI Creep corrosion on printed circuit boards
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=38
. Typical ions accounted for have included chloride, bromide, nitrate, sulfate, weak-organic acid (WOA), sodium and ammonium. Environmental and other concerns have driven the industry to adopt myriad flux formulations, which has created a need to further differentiate weak-organic acids beyond what a typical IC system can provide
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
) is removed by reaction with mild liquid organic fluxes (e.g. Indium Corporation’s 5RMA) or formic acid/N2. The use of formic acid as a reducing agent for tin (Sn) based reflow soldering has been widely studied and globally applied. Gas phase formic
