Electronics Forum: organism or reason fee (3)

Re: APEX 2000 is over, or is it just starting?

Electronics Forum | Sat Mar 18 13:01:02 EST 2000 | Rob Fischer

As one of the exhibitors I can say that I totally agree with you. It was the best show I've been to in quite some time. We were in the main hall and the attendees came for a specific reason and weren't dissappointed. The relaxed attitude of the sh

Automation Equipment Registration Fees

Electronics Forum | Mon Jun 23 16:24:44 EDT 2003 | quigs

To all involved in this thread, The topic of registration fees has been one of numerous conversations within our company. Being the North American Service Manager for Vitronics Soltec, I have been in many. These conversations also included many of

Industry News: organism or reason fee (2)

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Industry News | 2010-04-19 12:56:32.0

BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Association Connecting Electronics Industries (IPC)

Interview with Ray Bruce, head of the global SIPLACE CRM organization

Industry News | 2010-05-11 15:39:58.0

"Emerging from the crisis with innovations and build-to-order" The signs of a recovery in electronics manufacturing are intensifying. For Ray Bruce, head of the global SIPLACE CRM organization, and his team, the goal is now to arrive at the right short-term and medium-term conclusions from the changes. Bruce also believes that manufacturers are now called upon to develop and support new production concepts.

Siemens Process Industries and Drives

Technical Library: organism or reason fee (1)

Avoidance of Ceramic-Substrate-Based LED Chip Cracking Induced by PCB Bending or Flexing

Technical Library | 2022-09-25 20:18:33.0

Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.

Cree Lighting

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