New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Electronics Forum | Mon Oct 09 10:58:26 EDT 2006 | Matt Smith
Over the past several months we have experienced intermittent problems with wave solder voids on PCBs coated with OSP. We suspect variation in the OSP application process, or oxidation of the surface due to insufficient or degraded OSP. Is there a me
Electronics Forum | Thu Oct 14 16:38:29 EDT 2021 | SMTA-64387687
OSP is there to keep the copper from oxidizing. Once you wash the board, the copper is exposed. So, you have to either use it right away, or store it in a non-oxygen environment (vacuum/nitrogen).
Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
Industry News | 2008-03-13 20:19:57.0
Pomona, CA - March 2008 -The Contacts Product Group (CPG) of Everett Charles Technologies (ECT) and atg Test Systems announces that it will exhibit LFRE, its Lead-Free POGO Contacts, in booth 1383 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008, in Las Vegas.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. This plating also covers the copper layer, protecting it from oxidation. Many finishing materials currently exist, each with its own set of trade-offs
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. Without a nitrogen blanket one can expect heavier oxidation of the surfaces to be soldered. In addition, the no-clean fluxes are not as active as the water soluble fluxes, therefore reducing the oxides is more difficult
