Industry News | 2010-09-29 23:32:58.0
Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2026-03-12 20:17:16.0
SolderKing Assembly Materials has launched SAC0307, a new low-silver addition to its SK P2-5 solder paste range. The new product enables manufacturers to review alloy selection while retaining the same flux chemistry and established process settings. This provides a practical option for high-mix production environments where material choices are assessed across different assemblies.
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
SMTnet Express, January 4, 2024, Subscribers: 25,270, Companies: 11,980, Users: 28,604 █ Electronics Manufacturing Technical Articles Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for Sn
| http://etasmt.com:9060/te_news_industry/2013-04-28/4161.chtml
| I.C.T After-sales Service (81) Why Nitrogen Reflow Oven (1457) SMT Technical How many PCB classifications are there? From structure talk How many PCB classifications are there
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing
