Electronics Forum | Fri Jul 15 13:16:08 EDT 2005 | Brian
We have seen this problem in the past and had to deal with similar customer constraints. It's not the flux causing the wetting, but the placement and pad geometries as some have mentioned. To reduce or eliminate the problem, we have changed the ape
Electronics Forum | Thu Jul 07 18:16:36 EDT 2005 | russ
What size discrete components and have you evaluated your pad geometries? If pads are too far apart this will happen. The flux resudue is simply there because you didn't solder the component. It will stay on top of the solder bump. You can see this
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
| https://www.smtfactory.com/I-C-T-3D-Spi-smt-Solder-Paste-inspection-machine-I-C-T-S400-pd49143724.html
. 3.The multi direction 3D projection method can effectively solve the detection error caused by the shadow effect in the solder paste detection process. 4
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/121917-new-dispensing-technology-released-by-nordson-efd-in-2017
Lubrication Systems Mixers Pest Control Systems Reservoirs and Pumps Solder Paste and Flux Syringe Barrels and Cartridges Thermal Compounds (TIM) Two-Component (2k
