Industry Directory | Manufacturer
Datapaq, founded in 1984, is the world leader in temperature profiling. Datapaq systems provide key information on the effectiveness of heat processing in the electronics assembly industry, using the most advanced and tested techniques.
Industry Directory | Manufacturer / Manufacturer's Representative
VNPT Technology - Professional Electronics Manufacturer in Vietnam
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Fri Apr 01 03:02:59 EDT 2011 | grahamcooper22
starting point with zone settings would be, 100 / 160 / 200 / 225 / 260 deg C...but you'll have to check the exact profile on the pcb with a reflow profiler....making sure you meet the paste spec and making sure you don't heat any devices up to quic
Electronics Forum | Fri Jul 24 09:20:57 EDT 2009 | esolano
Any ideas, guys?
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control
Used SMT Equipment | Soldering - Reflow
13 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane, Gen 5.2, OMS
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Industry News | 2018-10-18 09:42:39.0
SMT reflow oven process principle and introduction
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | Pick and Place/Feeders
HELLER - SPARE PARTS HC1 TEMPRERATURE CONTROLLER .HC1 Rotary Encoder Heller ..E40H12-200-6-L-B Motor for Heller oven ..86YSY80-2 HEATER OF HELLER ..HEATER OF HELLER Reflow Heller Heater ..HL-255 Heller Motor JF1F071N Encoder
Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Career Center | Cavite, Philippines | Maintenance,Production,Technical Support
January 15- 2013 to Prsent :Maintenace Technician National Agriculture Development Company Haradh Project 2557 Riyadh 11461, Saudi Arabia Responsibilities 1. Daily checking of Electrical Panels 2. Install Main power for
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Lewis & Clark | http://www.lewis-clark.com/product-tag/8-zone-oven/
8 zone oven Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
Heller 公司 | https://hellerindustries.com.cn/vacuum-oven-10-zones
Voidless Vacuum Reflow Oven With 10 Heated Zones » 无空洞/真空回流焊炉 » 1911MK5-VR 真空回流焊炉 1911MK5-VR 真空回流焊炉 无空洞真空回流炉 1911MK5-VR 适用于大批量生产,具有(10) 对流区和 (1) 红外加热区,加热长度为 364 厘米(143 英寸)。它始终如一地提供高水平的可重复性和低 ΔT,同时降低维护要求和拥有成本。 回流炉长度 590cm 工艺气体选项 空气、氮气、甲酸、合成气体 加热区 对流