New Equipment | Curing Equipment
TrioTek™ inline heat curing ovens from ETS are ideal for medium to high-volume curing, baking or drying of conductive inks, conformal coatings,adhesives, encapsulants and potting compounds. They are easy to integrate with automated spray and dispense
New Equipment | Curing Equipment
TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing/drying of coatings, adhesives and potting compounds. They are easy to integrate with automated spray and dispense systems and are equipped with a unique downdraft exhaus
Electronics Forum | Fri Sep 07 16:53:37 EDT 2012 | burb1999
We have Heller, 1707EXL now. It has a removable support for the mesh conveyor that just pull out (clipped in). Had an Electrovert and they were bolted on and very tuff to change out. The oilers Im not sure I care for though,they have a metal rail t
Electronics Forum | Fri Feb 05 11:39:34 EST 2016 | steprog
I thought it might be the oven too, except it seems the splatter is too small for drips from the oven, secondly, when I ran a couple of bare boards among the populated boards we saw no splatter or flux contamination. So it seems it comes from the bo
Used SMT Equipment | Soldering - Reflow
TrioTek: Ultraviolet UV Curing, IR Thermal Curing, Moisture Curing for encapsulants, adhesives, conformal coatings and potting compounds TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing or drying of encapsulants, con
Industry News | 2018-10-18 09:23:19.0
CHOOSING A SELECTIVE SOLDERING MACHINE
Industry News | 2012-02-15 20:26:28.0
Kyzen had introduced a new and improved product for cleaning pallets and maintenance applications.
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
Career Center | Thanjavur, India | Production,Quality Control,Technical Support
work in one year and above Quality engineer in sanmina,current work in SMT Technical engineer in coimbatore
SMTnet Express, February 11, 2016, Subscribers: 24,106, Members: Companies: 14,981, Users: 39,912 Effective Methods to Get Volatile Compounds Out of Reflow Process Gerjan Diepstraten; Vitronics Soltec Although reflow ovens may not have been
. Flux accumulation and dripping inside the oven not
Heller 公司 | https://hellerindustries.com.cn/part/444805/
444805 » Parts » 444805 444805 : EXHAUST DRIP PAN Part Name: EXHAUST DRIP PAN Part #:444805 Contact Us About: EXHAUST DRIP PAN, 444805 Machine Tooth Sprocket E-Mail Us: Fields with * are required
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