The DispenseJet DJ-9500 supports a long list of jettable fluids for a wide range of applications. Incorporating over 15 years of jetting experience, the DJ-9500 jet provides even more capability than its DJ-9000 predecessor. Nordson ASYMTEK's jettin
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
Electronics Forum | Mon Jul 29 16:43:55 EDT 2002 | mcm4me
I have a customer with up to 8% scrap from one board supplier and 1% from another supplier for solder dewett and no wet over ENIG finish with mask defined pads. Initially I suspected mask residue on pads because of the no wets but I have come to find
Electronics Forum | Fri Sep 17 03:03:29 EDT 2010 | grahamcooper22
Hi Gani, looking at the HASL icture and the poor wetting of the solder over the pads I would imagine that the HASL coating is very thin on the pads and in actual fact isn't 'solder' but is tin /copper intemetallic and this has poor solderability. It
Used SMT Equipment | Screen Printers
2.0 Cmk @ ± 12.5 μm (± 6 sigma) System alignment capability > 2.0 Cmk @ ± 25 μm (± 6 sigma) Optimum core cycle time 8 seconds Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) Operating System Windows 7 Embe
Used SMT Equipment | Screen Printers
DEK Horizon Specs: DEK HORIZON Screen Printer D.O.M.:2000 S/N:274691 Top Clamp Board Hold down, Wet/Dry/Vacuum wiper, Pin Support tooling, and External Vacuum Pump Location:Chicago, IL Machine being auctioned off June 12th - 14th at the
Industry News | 2003-03-31 09:43:08.0
With Schedectady International to develop, manufacture, and sell waterborne photoimagable etch resists and soldermasks in North America.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000
JPG_副本1.jpg)
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000
Technical Library | 2016-05-26 15:07:36.0
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides, in corrosion studies, the role of salt residues -with Cl ion- on some metals is known as being promoters of oxidation or corrosion. On the other hand, most of corrosion studies with tin metallization are focused mainly on the corrosion resistance of tin alloys, but little has been done respecting to the influence of salts on tin metallization wetting. In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Technical Library | 2016-01-21 16:52:27.0
Solder paste has long been viewed as "black magic". This "black magic" can easily be dispelled through a solder paste evaluation. Unfortunately, solder paste evaluation can be a challenge for electronic assemblers. Interrupting the production schedule to perform an evaluation is usually the first hurdle. Choosing the solder paste properties to test is simple, but testing for these properties can be difficult. Special equipment or materials may be required depending upon the tests that are chosen. Once the testing is complete, how does one make the decision to choose a solder paste? Is the decision based on gut feel or hard data?This paper presents a process for evaluating solder pastes using a variety of methods. These methods are quick to run and are challenging, revealing the strengths and weaknesses of solder pastes. Methods detailed in this paper include: print volume, stencil life, response to pause, open time, tack force over time, wetting, solder balling, graping, voiding, accelerated aging, and others.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Precise coating discrete dots with the DispenseJet DJ-9500. http://www.nordsonasymtek.com
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Activator cleans metal surfaces of oxides and contaminants, promoting wetting of Solder Alloy. Activator is consumed by heat over time
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
. Non Wetting Or De Wetting Non-wetting is an SMT defect that occurs when the base metal surface on the board doesn’t accept the molten solder, creating a poor joint condition where a component’s terminals
