Electronics Forum | Tue Nov 14 13:39:37 EST 2000 | Mark S
Hi All -- I'm about to design a DPAK part (case 369A-13, Issue Z)onto a PCB . The part's maximum length as given in the datasheets (On-Semi MAC4DHM) is 0.030" longer than the recommended land pattern as given in that same datasheet. (1) Has anybod
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-components-during-reflow-float-off-pads
mass of solder and pulls the leads off the pads, resulting in no heel fillets. The component lead land areas need to be longer to accept this movement of the component on the large thermal pad
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. Solder paste needs adequate reflow temperature to melt, wet, and interact with the copper pad or other board metallization and component metallization to form the solder joint
winsouce.jpg)
