Industry Directory | Manufacturer
Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
The depaneling process of this model is operated only in Y-direction. Can be equipped with differing cutting fixtures. It should be noted here, that the PCB panel is processed in Routing Spindle. The routing spindle is mounted onto a Y- linear-axi
Electronics Forum | Fri Mar 27 17:26:36 UTC 2026 | SMTA-74487602
Curious what everyone is using in terms of their reflow profiler. I've used KIC and ECD and liked KIC way better due to the predictive features that helped you optimize your profile. Was recently at APEX and saw SolderStar and was pretty impressed
Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Industry News | 2023-03-30 22:45:02.0
Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.
Industry News | 2015-11-12 22:03:28.0
Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
Good Quality Hot Air Lead Free Led Reflow Oven in SMT Line ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | pro
Career Center | , Sant Julia de Loria Saudi Arabia | Engineering,Production,Research and Development
SNR MANUFACTURING ENGINEER WANTED Design Change Management and New product Introduction. Solder paste printing process (knowledge of Fuji screen printer machines. Stencil design/ modification and the use of Gerber data. SMT placement machines (Kno
Career Center | chennai, Tamil nadu India | Engineering
1) Programming knowledge in Screen Printing, Reflow ,Wavesoldering process 2)Trouble shoot the process defects in Screen Printing 3)Evaluate the process using Statistical Process control 4)Quote,layout and new line readiness
Career Center | FARIDABAD, HARYANA India | Engineering,Maintenance,Management,Production,Quality Control
SMT Maintenance ( Samsung Techwin Screen Printers, Solder Paste Inspection, Panasonic & Fuji Chip Mounters & Multi Mounters, Heller Reflow Machines, Functional Testing Inline Machines, Epoxy Dispensors, Underfill Reflow, Routers) Industrial Enginee
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores
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