New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo
Electronics Forum | Sun Oct 10 15:07:04 EDT 2004 | GIO
sorry..it s 40 mils...pitch,...but stencil aperture is square...ANY COMMENTS.. THANKS RUSS...
Electronics Forum | Thu Sep 30 17:36:17 EDT 2004 | GIO
i have a 0.5 pitch(19x19 pbga array) ..with a pad of 20 mils (thou) , solder mask is same...(20th..)..and an stenCil aperture of rectangular 22 X 22.1 thou...WHICH SHOWS..I AM HAVING AN OVERPRINT..MY PASTE IS A NO-CLEAN.. COMMENTS PLS...
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
