Features: 1. This machine selects the intelligent level sirocco and rapid infrared heating technology controlling, equipped with special design wind wheel, speed stability and uniform temperature, suit for uninterrupted soldering the LED and BGA com
Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
Electronics Forum | Tue Apr 10 10:21:06 EDT 2018 | slthomas
Dave, that's a cool idea and sounds like something that would actually work. I'd be tempted to go with oversized pads to increase the holding force. Unfortunately as an EMS we would have to work that through the customer approval system and as usual
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Industry News | 2009-02-11 23:36:26.0
RANCHO CUCAMONGA, CA � February 2009 � Aqueous Technologies Corp. announces the StencilWasher MP, a fully automatic misprint and stencil cleaning system that is designed to remove non-reflowed solder paste and adhesives from misprinted assemblies, stencils, and screens, as well as post-reflow circuit assemblies.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
.gif)
