Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Multilayer Mixed Dielectric PCB Specifications:
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
Electronics Forum | Thu Aug 21 22:10:07 EDT 2003 | adlsmt
Well, for some reason the board house will pay for the boards but has some issue with paying for the parts on them. Why am I not supprised? Perhaps I have mis-diagnosed the problem. We have found two different board p/n's with the same type of defec
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2010-11-29 17:46:48.0
With many new legislators coming to Washington, it is a critical time to support ongoing efforts to strengthen the U.S. electronics manufacturing industry. To that end, IPC will hold the IPC Summit on American Competitiveness, February 1–2, 2011, in Washington, D.C.
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
BEST Inc master instructor Norman Mier demonstrates how to replate gold fingers using the BEST gold contact replating kit. In this video he demonstrates how to repair, prepare and replate the finger using a gold replating solution. If you want to lea
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
aluminum or gold wire. Gold wire provides the abilit
Blackfox Training Institute, LLC | https://www.blackfox.com/how-to-remove-oxidation-from-soldering-iron-tips/
. Most of which is caused by a heavy buildup of oxidation on the soldering iron tip’s surface. A bad tip is unable to perform an effective heat transfer to the connection point, which then affects the final product in the assembly line
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/gold-finger-repair
. Price varies depending on size and quantity. Standard price to replace a Gold Finger Contact is $50.00 each. Call (888) 406-2830 for a free quote
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
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