Electronics Forum | Fri Feb 19 02:11:11 EST 1999 | Pete Sorenson
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
Industry News | 2013-06-07 15:41:36.0
IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2013 is now available from IPC — Association Connecting Electronics Industries®. T
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Technical Library | 2013-07-18 12:12:40.0
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.
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SMTnet Express July 18, 2013, Subscribers: 26169, Members: Companies: 13430, Users: 34947 Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods by Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/live-demonstrations-on-nordson-inspection-systems-at-apex
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| https://www.eptac.com/soldertip/whats-with-the-expiration-dates-on-solder-paste-or-wire/
leakage and create dendritic growth on the laminate material or between component leads which will cause failures. Ok, so is there a test I can perform to determine if my solders are good enough to use
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