Electronics Forum | Thu Apr 19 02:49:07 EDT 2007 | ray
I observed some black dot or some oxidation occured on chip termination on pcba reflowed fews weeks ago as buffer stock. The solder joint and fillet wetting is good and shinning. It is an acceptable or defect condition per IPC standard/requirement? W
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
. In order to supply sufficient flux for complete removal of tin oxides, knowledge about the oxidation state of tin oxides on new and on aged immersion tin final finishes were obtained
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request Connected load 68KW Operating capacity 16 KW As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here. I.C.T keeps working on quality and performance
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