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New Equipment | Rework & Repair Equipment
The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m
New Equipment | Rework & Repair Equipment
Poor handling procedures may sometimes damage corners and edges on printed circuit boards. Most of these types of damage to PCB's can be repaired using the BEST Board Repair Kit. This versatile repair kit along with our clear "how to" instructions of
Electronics Forum | Wed Jun 08 13:49:48 EDT 2011 | sonofptolemy
Hello, I am having a problem with HASL PCB's after it comes back from the stuffer. To me it looks like oxidation and it causes poor wetting. This leads to a bunch of problems all of which have different symptoms but the cause is this oxidation proble
Electronics Forum | Thu Aug 01 08:58:47 EDT 2002 | Rick Lathrop
Good morning Dave F. I am not going to try to touchup the solder pad until I get surface analysis work done, don't want to ruin the evidence. I am getting XPS work done not XRF, XPS is X-ray Photoelectron Spectroscopy and can see very thin films of o
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2014-10-01 15:59:00.0
PCB provider Cirtech Electronics located in Cape Town, South Africa will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid. Bidding for the auction will open promptly at 8:00am PDT on October 7th, 2014 and will begin closing at 6:00am PDT on October 14th, 2014.
Industry News | 2014-10-10 16:27:51.0
CB provider Cirtech Electronics will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid.
Parts & Supplies | Pick and Place/Feeders
Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00
Parts & Supplies | Pick and Place/Feeders
Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00
Technical Library | 2020-07-29 20:12:52.0
Aluminum is a metal that it is hard to solder due to the high surface tension difference between it and molten solder alloy. This occurs because aluminum rapidly forms a tenacious oxide layer whenever it is exposed to oxygen in the air. The oxide layer is responsible for the high surface tension difference between the aluminum and the solder and impedes the solder from spreading evenly on an aluminum surface. There are hundreds of aluminum alloys available in the marketplace; it is important to identify the form of aluminum that is being soldered. Once this is done, an appropriate soldering technique can be chosen for soldering the specific aluminum alloy under consideration. Direct aluminum soldering eliminates using expensive plating techniques to prepare the aluminum surface for soldering.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
BEST Inc master instructor Norman Mier demonstrates how to replate gold fingers using the BEST gold contact replating kit. In this video he demonstrates how to repair, prepare and replate the finger using a gold replating solution. If you want to lea
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
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. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
