Gas Chromatographs, gas analyzer packages and specialty gas handling educational, laboratory and industrial gas applications
Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative
Nolatek is a buyer and seller of general test and measurement equipment. We also buy and sell industrial surplus ranging from heavy machinery to semiconductor equipment.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Test Equipment
slim kic 2000 Specifications: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Wed Oct 09 11:15:40 EDT 2002 | Randy V
Boothroyd and Dewhurst has DFA packages that are pretty good but are more for analyzing one design to an alternate design vs giving good times for your particular site, etc. You can find their site on the WEB.
Used SMT Equipment | X-Ray Inspection
Details: • Software IA 4.0.10.0 MIL6 • System Version 5.0 Analyzer • Tube: 160kv (Transmissive tube) • 220 Vac, 60 HZ,10 Amps • Tilt/Turn Arm Condition: Complete & O
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our Orbotech Symbion S36 AOI For Sale. The system is Year 2006.... Excellent condition !!! Complete with all accessories and manuals. Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI p
Industry News | 2023-11-20 15:14:33.0
MIRTEC announces its receipt of the prestigious 2023 GLOBAL Technology Award in the Conformal Coating Equipment category. The award was presented in recognition of MIRTEC's groundbreaking GENESYS-CC AI Based Conformal Coating AOI Series during an award ceremony held at productronica in Munich on Nov. 14, 2023.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Parts & Supplies | General Purpose Equipment
FEATHERS 1. Efficiency, collect data continuously for 16 times and forward to computer to analysis grouping; 2. It is available base on PC (WINDOWS) and PDA(Pocket) to analyze; 3. Low power, use lithium battery that can k
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
Technical Library | 2019-10-03 14:27:01.0
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
slim kic 2000 Specifications: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | Denver (Metro), Colorado USA | Engineering,Production
Characterization, optimization, and generation of control plan for PCB (SMT and PTH) assembly processes. Monitor defects and improve yields. Conduct design of experiments, collect and analyze data, conduct machine capability studies, automated equipm
Career Center | , North Carolina USA | Engineering,Production
Description: Characterization, optimization, and generation of control plan for SMT processes. Problem solving for SMT placement and soldering issues. Monitor defects and improve yields. Conduct design of experiments, collect and analyze data, conduc
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | BANGALORE, India | Engineering,Management,Production,Purchasing,Quality Control,Sales/Marketing,Technical Support
With an experience of 5 years well verse in technical skills of electronic component procurement, knowledge in both hardware and SMT production with process, quality approval, IPC Standards, data sheet reading,analyzing ability,process and people man
SMTnet Express, October 3, 2019, Subscribers: 32,260, Companies: 10,890, Users: 25,178 Effects of Temperature Uniformity on Package Warpage Credits: Akrometrix Knowing how package warpage changes over temperature is a critical variable in order
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
: SMTA International Abstract: The Pb-free solder joint attachment reliability of two Quad Flat No-Lead (QFN) packages with different body sizes and die to package ratios (DPR
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
thermal expansion (CTE) mismatch between the package and the PCB [20, 21]. The CTE of the PCB was measured using a thermomechanical analyzer (TMA) and the composite coefficients of thermal expansion of the 192CABGA and 84CTBGA packages were measured using
