Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
Industry Directory | Manufacturer
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
ProntoAOI is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as YESTech, Mirtec, Orbotech, Agilent, Omron, CyberOptics, Vi
Electronics Forum | Tue Nov 27 20:51:18 EST 2007 | chs
Anyone can share experience on package crack for QFN package. This package is so sensitive to any external force. Any good recomendation on desoldering / rework procedure.
Electronics Forum | Sun Dec 02 20:02:23 EST 2007 | chs
Hi, There are QFN 32,40,48 pins with middle pad. Body size are 7x7 and pitch 0.5mm. I means as compared to 2 sided package, QFN are easily damaged by external mechanical / thermal force. Phenomenon observed are mold cap open which further caused wire
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Used SMT Equipment | Chipshooters / Chip Mounters
sFAB-D machines have continued to evolve since their release to the market. They are able to insert parts into various panels with a wide range of support in part packaging. As an entry model, sFAB-SH machines are now added into the same product line
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2003-04-03 08:51:07.0
Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming
Parts & Supplies | Assembly Accessories
Detailed Product Description Original: Japan Name: IO Boards Model: 945 Brand: Samsung Usage: SM421 Stocks: Yes Samsung SM421 IO SMT PCB Assembly , 945 Main SMT Printed Circuit Board Assembly Description: Name: Main Boards Brand: Sam
Parts & Supplies | Component Packaging
Original Ipulse M003 SMT Nozzle For M1 SMT machine Surface mount Machine Detailed Product Description Brand: Ipulse Machine Model: Ipulse Machine Part Name: Nozzle Model: M003 Condition: Original New Origin: Japan Original Ipulse M003
Technical Library | 1999-05-06 10:46:06.0
Pentium-class portables present significant packaging problems. The heat generated inside a notebook not only reduces microprocessor reliability, but the reliability of peripheries such as hard drives and video chips. Although the processor is the primary heat-generating source, it isn’t always the component least tolerant of temperature...
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
www.unisoft-cim.com/prontoaoi.htm - ProntoAOI software from Unisoft is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Webinar: The IPC Digital Twin Standard
Career Center | San Jose, California USA | Engineering,Research and Development
Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Actively participate in the developmen
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/extended-sop-package-name_topic1103_post4316.html
Extended SOP Package Name - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Extended SOP Package Name
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/packaging?con=t&page=11
Nordson hot melt adhesive application and verification systems for package sealing & labeling Adhesive Dispensing Systems Corporate | Global Directory
winsouce.jpg)
