Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
Industry Directory | Manufacturer
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
ProntoAOI is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as YESTech, Mirtec, Orbotech, Agilent, Omron, CyberOptics, Vi
Electronics Forum | Tue Nov 27 20:51:18 EST 2007 | chs
Anyone can share experience on package crack for QFN package. This package is so sensitive to any external force. Any good recomendation on desoldering / rework procedure.
Electronics Forum | Sun Dec 02 20:02:23 EST 2007 | chs
Hi, There are QFN 32,40,48 pins with middle pad. Body size are 7x7 and pitch 0.5mm. I means as compared to 2 sided package, QFN are easily damaged by external mechanical / thermal force. Phenomenon observed are mold cap open which further caused wire
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Used SMT Equipment | Chipshooters / Chip Mounters
sFAB-D machines have continued to evolve since their release to the market. They are able to insert parts into various panels with a wide range of support in part packaging. As an entry model, sFAB-SH machines are now added into the same product line
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2003-04-03 08:51:07.0
Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming
Parts & Supplies | Assembly Accessories
Detailed Product Description Original: Japan Name: IO Boards Model: 945 Brand: Samsung Usage: SM421 Stocks: Yes Samsung SM421 IO SMT PCB Assembly , 945 Main SMT Printed Circuit Board Assembly Description: Name: Main Boards Brand: Sam
Parts & Supplies | Component Packaging
Original Ipulse M003 SMT Nozzle For M1 SMT machine Surface mount Machine Detailed Product Description Brand: Ipulse Machine Model: Ipulse Machine Part Name: Nozzle Model: M003 Condition: Original New Origin: Japan Original Ipulse M003
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Technical Library | 2021-02-20 00:55:47.0
Customers must be able to rely on accurate humidity indication as an assurance of SMD quality and fitness for processing and use. Without it, they might accept SMDs from suppliers that have already been irreparably damaged by moisture during storage or transit. Or, they might approve for processing SMDs that have been improperly or insufficiently heat-dried. Beyond the processing questions, there are financial questions: Where did the dry pack problems originate and who--supplier, customer, shipper--is financially responsible for the damaged SMDs? In response, Clariant, the originator of the color change humidity indicator card, and a member of the JEDEC's Subcommittee 14.1, "Reliability and Test Methods for Packaged Devices," created a new "non-reversible" halogen and cobalt dichloride free humidity indicator card. This HIC combines two reversible indicators (5% and 10%) with a new non-reversible (60% RH) indicator spot. (Figure 1) The 5% and 10% reversible spots work the way similar indicators do: they change color from blue (dry), to lavender, to pink (wet) to indicate humidity exposure at the indicated levels. If humidity levels drop, they will gradually revert back to blue.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
www.unisoft-cim.com/prontoaoi.htm - ProntoAOI software from Unisoft is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Webinar: The IPC Digital Twin Standard
Career Center | San Jose, California USA | Engineering,Research and Development
Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Actively participate in the developmen
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/extended-sop-package-name_topic1103_post4316.html
Extended SOP Package Name - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Extended SOP Package Name
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/packaging?con=t&page=11
Nordson hot melt adhesive application and verification systems for package sealing & labeling Adhesive Dispensing Systems Corporate | Global Directory
