Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Board Handling - Storage
Dr. Storage offers the most diverse selection of Dry Cabinets in the industry. The latest Dr. Storage cabinets include cabinets drying at 1% RH, drying at less than 1% RH and baking at 60°C. Cabinets are plug and play so they are up and running easil
New Equipment | Board Handling - Storage
Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-101 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Stands, 1 M ω Ground Wire Model: SDC-101 Fast Super Drye
Electronics Forum | Mon Dec 30 13:52:50 EST 2002 | bcceng
Haran, This problem can also be caused if the BGA package is POPCORNING. Popcorning causes the BGA package to expand below the die, seen this happen so often to customers that try to install BGA's themselves without the proper handling of BGA's. Tha
Electronics Forum | Fri May 15 04:06:33 EDT 1998 | Alan Pestell
We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. How d
Industry News | 2017-10-24 17:22:53.0
Seika Machinery is pleased to announce that IC packages and LEDs can be stored in a dry box at five percent RH or less for indefinite floor life. Five of the McDry storage cabinets offer less than one percent RH, including: DXU-1001, MCU-201, MCU-301, MCU-401 and the DXU-580SF Feeder Storage Cabinet.
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
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