Industry Directory: pad adhesion strength (17)

United Adhesives, Inc.

Industry Directory | Manufacturer

United Adhesives makes special adhesives, coatings, potting gels, sealants, various conductive adhesives, and optical adhesives for applications in electronics, semiconductors, and telecommunications.

Henkel Electronic Materials

Industry Directory | Manufacturer

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

New SMT Equipment: pad adhesion strength (92)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Electronics Forum: pad adhesion strength (349)

Re: Adhesive strength specs

Electronics Forum | Wed Dec 10 14:37:47 EST 1997 | Frank Murch

There is a direct relationship between adhesive strength and surface area. If you graph this it will be linear. The amount of the adhesive should be about 2/3 the gap between the pads. Pad designs change all over so a true and tried rule does not ex

how to measure Adhesive strength

Electronics Forum | Wed May 20 09:52:50 EDT 2009 | dwelch123

Use a push/pull tester. I use an OBA inst. works Ltd. tester. Just because mask comes off with bonder doesn't mean bonder is strong or cured right. Mask can be weak in between pads do to area size. Do it right and you'll know for sure. To many people

Used SMT Equipment: pad adhesion strength (6)

Aqueous Technologies SmartOne SonicOne Stencil Cleaner

Aqueous Technologies SmartOne SonicOne Stencil Cleaner

Used SMT Equipment | Stencil Cleaners

Aqueous Technologies SmartOne Stencil Cleaner Automated Stencil and Batch Wash Vintage: 2004 Currently set up for stencils, baskets are needed for batch process Built-in Display Screen Easy-use touch pad Wash Solution Temp Control Tank Heater

Assured Technical Service LLC

Fuji GL541E

Used SMT Equipment | Adhesive Dispensers

Fuji GL541E *Basic Specifications Cycle time 0.09 seconds/dot Travel distance - X-axis within 8mm Y-axis within 6mm Needle up/down distance of 8mm Application time: 0.05 seconds Dispensing accuracy: +/- 0.15mm in th X and Y directions (3 sigma)

SMTS LTD.

Industry News: pad adhesion strength (226)

Long Life for Heatsink Thermal Tape

Industry News | 2003-07-02 08:54:26.0

A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.

SMTnet

Easier Dispensing for Thermal Sealant

Industry News | 2003-02-24 09:32:24.0

Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.

SMTnet

Parts & Supplies: pad adhesion strength (70)

Surface Mount Techniques SMT Kapton Tape Polymide film tape

Surface Mount Techniques SMT Kapton Tape Polymide film tape

Parts & Supplies | Tape and Reel

SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param

KingFei SMT Tech

Panasonic Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic

Panasonic Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic

Parts & Supplies | Assembly Accessories

Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic Product Description: 1.it has paper guide for aligning carrier tape.except its 2 tape strips sticking on top & bottom of carrier tapes. The 3rd tape strip is

KingFei SMT Tech

Technical Library: pad adhesion strength (20)

Effect on Microwave Plasma Surface Treatment for Improved Adhesion Strenght of Direct Copper Plating on Polytetrafluoroethylene (PTFE)

Technical Library | 2016-01-07 19:13:23.0

The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and electroless copper plating. PTFE is widely used in many industries because of its unique electrical, thermal, and mechanical characteristics. However, because of its low surface energy, it is difficult to acquire enough adhesion strength between PTFE and other substances without surface modification. Plasma is well known as one of the surface modification techniques that improve adhesion strength.

Nissin Corporation

Study on Solder Joint Reliability of Fine Pitch CSP

Technical Library | 2015-12-31 15:19:28.0

Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.

Flex (Flextronics International)

Videos: pad adhesion strength (28)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

Peel Back Tester

Peel Back Tester

Videos

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Events Calendar: pad adhesion strength (2)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Adhesives & Bonding Expo

Events Calendar | Tue Mar 23 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | Novi, Michigan USA

Adhesives & Bonding Expo

Scheugenpflug Inc.

Career Center - Resumes: pad adhesion strength (5)

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

Sales&Marketing, Business Development

Career Center | Sungai Ara, Penang Malaysia | Management,Sales/Marketing

Spoken skills : English, Malay, Chinese, Cantonese, Korean (Basic) Writing skills : English, Malay, Chinese, Korean (Basic) Computer skills : Microsoft Office (Word, Excel, PowerPoint) Personal : Sense of responsibility, quick learner, can work in

Express Newsletter: pad adhesion strength (466)

Partner Websites: pad adhesion strength (162)

IPC-7251 & 3-Tier PTH Pad Stack Obsolete - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7251-3tier-pth-pad-stack-obsolete_topic1463_post5897.html

IPC-7251 & 3-Tier PTH Pad Stack Obsolete - PCB Libraries Forum   Forum Home > PCB Footprint Expert > Questions & Answers    New Posts    FAQ    Search    Events    Register    Login IPC-7251 & 3-Tier PTH Pad Stack Obsolete

PCB Libraries, Inc.

SMT

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt

. To manufacture the most durable PCBA requires optimum setup of the SMT line. Measuring the mechanical strength of component adhesion to the PCB allows new materials and manufacturing process parameters to be qualified prior to production ramp up

ASYMTEK Products | Nordson Electronics Solutions


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