Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
Industry Directory | Manufacturer
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Used SMT Equipment | Stencil Cleaners
Aqueous Technologies SmartOne Stencil Cleaner Automated Stencil and Batch Wash Vintage: 2004 Currently set up for stencils, baskets are needed for batch process Built-in Display Screen Easy-use touch pad Wash Solution Temp Control Tank Heater
Used SMT Equipment | Adhesive Dispensers
Fuji GL541E *Basic Specifications Cycle time 0.09 seconds/dot Travel distance - X-axis within 8mm Y-axis within 6mm Needle up/down distance of 8mm Application time: 0.05 seconds Dispensing accuracy: +/- 0.15mm in th X and Y directions (3 sigma)
Industry News | 2009-10-17 09:43:47.0
Reduce PCB Repair Costs
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Technical Library | 2022-01-26 15:22:33.0
Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented experimentally: adhesion strength and puncture strength. A modified blister test using a predefined blister area is employed to assess the adhesion strength and a puncture test is employed to evaluate the puncture strength of the coating. After measuring the properties at time zero, the coatings are subjected to accelerated testing conditions (high temperature/humidity storage and temperature cycling) and the degradations of the coating properties are documented.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Events Calendar | Mon Mar 22 18:30:00 UTC 2021 - Wed Mar 24 18:30:00 UTC 2021 | Novi, Michigan USA
Adhesives & Bonding Expo
Career Center | , NEW DELHI India | Engineering
Background includes a proven record of education, experience, and technical strengths in electronic circuit design and troubleshooting, software development, and versatility in operating systems. � Engineering experience working with designers, mark
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7251-3tier-pth-pad-stack-obsolete_topic1463_post5897.html
IPC-7251 & 3-Tier PTH Pad Stack Obsolete - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login IPC-7251 & 3-Tier PTH Pad Stack Obsolete
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. To manufacture the most durable PCBA requires optimum setup of the SMT line. Measuring the mechanical strength of component adhesion to the PCB allows new materials and manufacturing process parameters to be qualified prior to production ramp up
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