Industry Directory | Manufacturer
United Adhesives makes special adhesives, coatings, potting gels, sealants, various conductive adhesives, and optical adhesives for applications in electronics, semiconductors, and telecommunications.
Industry Directory | Manufacturer
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Electronics Forum | Wed Dec 10 14:37:47 EST 1997 | Frank Murch
There is a direct relationship between adhesive strength and surface area. If you graph this it will be linear. The amount of the adhesive should be about 2/3 the gap between the pads. Pad designs change all over so a true and tried rule does not ex
Electronics Forum | Wed May 20 09:52:50 EDT 2009 | dwelch123
Use a push/pull tester. I use an OBA inst. works Ltd. tester. Just because mask comes off with bonder doesn't mean bonder is strong or cured right. Mask can be weak in between pads do to area size. Do it right and you'll know for sure. To many people
Used SMT Equipment | Stencil Cleaners
Aqueous Technologies SmartOne Stencil Cleaner Automated Stencil and Batch Wash Vintage: 2004 Currently set up for stencils, baskets are needed for batch process Built-in Display Screen Easy-use touch pad Wash Solution Temp Control Tank Heater
Used SMT Equipment | Adhesive Dispensers
Fuji GL541E *Basic Specifications Cycle time 0.09 seconds/dot Travel distance - X-axis within 8mm Y-axis within 6mm Needle up/down distance of 8mm Application time: 0.05 seconds Dispensing accuracy: +/- 0.15mm in th X and Y directions (3 sigma)
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
Parts & Supplies | Assembly Accessories
Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic Product Description: 1.it has paper guide for aligning carrier tape.except its 2 tape strips sticking on top & bottom of carrier tapes. The 3rd tape strip is
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Technical Library | 2019-05-23 10:42:00.0
Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Mar 23 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | Novi, Michigan USA
Adhesives & Bonding Expo
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | Sungai Ara, Penang Malaysia | Management,Sales/Marketing
Spoken skills : English, Malay, Chinese, Cantonese, Korean (Basic) Writing skills : English, Malay, Chinese, Korean (Basic) Computer skills : Microsoft Office (Word, Excel, PowerPoint) Personal : Sense of responsibility, quick learner, can work in
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7251-3tier-pth-pad-stack-obsolete_topic1463_post5897.html
IPC-7251 & 3-Tier PTH Pad Stack Obsolete - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login IPC-7251 & 3-Tier PTH Pad Stack Obsolete
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. To manufacture the most durable PCBA requires optimum setup of the SMT line. Measuring the mechanical strength of component adhesion to the PCB allows new materials and manufacturing process parameters to be qualified prior to production ramp up
