Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
Industry Directory | Manufacturer
Boasting a complete EMS (electronic manufacturing services) production, engineering, and distribution facility we differentiate our services through: ��Aggressive pricing ��Rapid, responsive turnaround ��Personalized customer service�
Standard Silicone-Base Thermal Pads Qoolite – Cool Provide (SPVS) Flame resistant, high performance thermally conductive sheet Silicon Free Thermal Conductive Sheet Featuring Electromagnetic Wave Absorption Properties. High thermal conductiv
New Equipment | Board Handling - Storage
Intelligent Dry Storage Cabinets for Moisture Sensitive Devices The control of moisture sensitive devices (MSDs) prior to reflow soldering is a topic at the forefront of electronics manufacturing. Assemblers are adopting moisture management solutio
Electronics Forum | Tue Nov 08 20:58:49 EST 2005 | davef
We buy humidity as a potential cause of solder balls, but we're not biting on dewetting. Something else is causing that. Questions are: * What's the temperature and RH of your SMT production area? * What kind of paste are you using? [Some water was
Electronics Forum | Wed Nov 09 10:25:09 EST 2005 | Amol
where in india are you laxman? and what kind of manufacturing are you involved in?
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Technical Library | 2019-06-03 15:32:40.0
ACI Technologies was pleased to assist a customer by conducting elemental analysis on several assemblies displaying severe corrosion. Several board assemblies had failed in the field and exhibited areas of corrosion in close proximity to onboard components. The most common source of corrosion on electronic assemblies is residual flux. Fluxes are specific chemistries applied during the soldering process which improve the wetting of the solder to both the pad and component when forming the solder joint. They can be highly reactive chemicals that, if left on the assemblies, can lead to corrosion, electrical degradation, and decreased reliability. In the presence of moisture and electrical bias, flux residue can enable dendritic growth as a result of electrochemical migration (ECM).
Technical Library | 2020-11-29 22:06:45.0
Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.
This video is designed to help packaging engineers, quality control managers and those tasked with preserving critical parts in enclosed spaces for storage and usage. The video will highlight different features and benefits of the Moisture Hog desic
Great improvements on Makerfabs Lora Soil Moisture Sensor V3!!! 1. TLC555 removed, while the Atmega328P(D9/Timer1) generates the 2 MHz pulse (only during measurement phase, switching off afterward), for capacitive moisture measurement. 2. Unique ID b
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/155?order=name+desc
0.0 CNY VACUUM ABSORPTION ¥ 0.00 0.0 CNY VACCUM VALVE L ASM ¥ 0.00 0.0 CNY VACCUM SENSOR BRD ASSY ¥ 0.00 0.0 CNY VACCUM PUMP KIT 4M BASE DOP-420SA/420S ¥ 0.00 0.0 CNY VACCUM PAD ¥ 0.00 0.0 CNY VACCUM PAD ¥ 0.00 0.0 CNY VACCUM PAD ¥ 0.00 0.0 CNY VACCUM PAD ¥ 0.00
| https://www.eptac.com/faqs/ask-helena-leo/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating
: I have a question concerning ceramic CCA and their bake out after aqueous wash cycle prior to parylene coating. In theory, parylene deposition will draw off any moisture before the coating process
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