Electronics Forum | Wed Nov 20 01:38:53 EST 2019 | ajspec
Hi, i'm facing solder mask peel off but limited to the solder defined pad only(opening area). no peel off on the other area and it happened on electroless nickel immersion gold finishing only. for other finishing is not affected. kindly advise if you
Electronics Forum | Wed Oct 16 11:51:03 EDT 2002 | Brian W.
Pink Lady refers to solder stop, or temporary solder mask. There are a couple of types. Peelable, which you must peel off after processing, before wash, and of course before you ship. There is also a water soluble version, which dissolves in the w
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
Industry News | 2009-04-15 23:01:13.0
BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
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Parts & Supplies | Pick and Place/Feeders
KGW-M7881-00 rubber pad No.Part No.Part Name Q’ty Remarks Change Compati. 1 KHJ-MC50C-00 SEAL,MAIN LABEL 1 2 KHJ-MC532-00 SPROCKET 1 4 KHJ-MC53E-00 BOLT HEX.S/H LOW 1 5 KHJ-MC541-00 TAPE GUIDE ASSY.1 5-1 KHJ-MC541-01 TAPE GUIDE ASSY.1(20
Parts & Supplies | Visual Inspection
We can supply you the following UNIVERSAL Feeders. Also Feeder Parts, Feeder Storage Carts / Feeder Trolley, Feeder Calibration Jig. 49889209 8mm High Performance DL-60 (Gold Plus) 49889210 8mm High Performance DL-60 (Gold Plus) 49889211 8mm High
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
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parts Products ASSEMBLEON Others SMT parts Public Pricelist Public Pricelist Peel off module TTF ¥ 0.00 0.0 CNY Peel off handle assy ¥ 0.00
