Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
Industry Directory | Consultant / Service Provider
PWB America, Inc. is a complete solution for prototype PCB layout design, fabrication and assembly. Providing quick turn
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Thu Oct 26 05:26:53 EDT 2000 | Mika Pirttimaa
Well, Yes those measurements are required as long as your process is not in control. It is true that quality people easily demand too much and are too strickt in the areas that are not so important. Height of the pad is one of them, it is not very in
Electronics Forum | Thu Aug 18 12:10:40 EDT 2011 | rdubya
Do you happen to know of any good labs for this analysis?
Used SMT Equipment | In-Circuit Testers
The 89431A RF Section is designed to couple with an Agilent 89410A Vector Signal Analyzer (VSA) to extend the coverage from 10 MHz to 2.65 GHz. When an Agilent 89410A VSA and an 89431A RF Section are combined, it makes an Agilent 89441A VSA. Fo
Used SMT Equipment | In-Circuit Testers
The 89431A RF Section is designed to couple with an Agilent 89410A Vector Signal Analyzer (VSA) to extend the coverage from 10 MHz to 2.65 GHz. When an Agilent 89410A VSA and an 89431A RF Section are combined, it makes an Agilent 89441A VSA. Fo
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
 ELBOW UNION PJ304085104.jpg)
Parts & Supplies | Pick and Place/Feeders
JUKI FX-1(FX-1R) ELBOW UNION PN:PJ304085104 Supply all juki spare parts at a lower price. pls contact us if you have interested. JUKI E6947705000 REEL PRESSURE BASE 12/16 SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E6948705000 SHUTTER COVER 12/16 ww
.jpg)
Parts & Supplies | Pick and Place/Feeders
Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0 JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Technical Library | 2009-04-30 18:06:24.0
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Career Center | Fremont, California USA | Engineering
Job Description: • Has full ownership of HW design and release including HW specification creation, schematic generation, PCB layout, board bring up, and design verification. • Complete PCB design schematic using Orcad capture. • Complete HW desig
Career Center | Fremont, California USA | Engineering
Interprets electrical design requirements and uses Allegro design tool to create original PCB layouts, detailed fab drawings, schematics, and other design files. Work with HW design engineer to make sure PCB layout meet PCB design requirements.
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/advanced-features/sonosimulator
. In the process the die stack also creates many internal interfaces where critical defects, such as voids and delaminations, can lurk
| https://www.eptac.com/wp-content/uploads/2013/08/eptac_08_21_13-1.pdf
