Industry Directory | Distributor
PANASONIC CM202 CM402 CM602 Description: Original and brand new, large quantity of stock. # Nozzle 110F 115A 120 130 140 205 206A 225C 226C 230C 235C 240C for 8-Nozzle Head # Nozzle 110S 115AS
Industry Directory | Distributor
Toshi Technology Inc. is a specialist in buying and selling, both Nationally and International, used Circuits Assembly Equipment and Automatic Test Equipment. (Fuji, Panasonic, Universal, etc)
Panasonic KME CM402/602 machines feeder, MSF,HT,BM machines feeder 8mm Tape Feeder KXFW1KS5A00 with sensor 8mm TapeFeeder KXFW1KSBA00 without sensor， 12/16mm Tape Feeder KXFW1KS6A00 with sensor, 24/32mm Tape Feeder KXFW1KSDAOO without sensor 2
New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
Electronics Forum | Wed Feb 22 21:21:09 EST 2023 | cbeneat
One expense reduction is to order parts from SMTXTRA. I am not affiliated at all with them; however, I buy from them as much as possible. Usually 30-40% price difference from Panasonic. Example is the waste bins for Panasonic NPM's-$183.49, Last time
Electronics Forum | Mon Apr 28 16:36:11 EDT 2003 | razor
Component: Termination (barrier) NI, 120/3.0 um Solder Plate (outer) 90% Sn, 10% Pb, 120/3.0 um Solder: Multicore CR39, 95.5%Sn/3.8%Ag/.7%Cu @ 6mil Flex PCB: Cu, Ni, Au .2m to .5m Thanks
Used SMT Equipment | AOI / Automated Optical Inspection
ORBOTECH, Visual inspection machine, type TRION 2340, s.n. 0601265, with 3D edge detection, included DELL PC inside and flat monitor HP, size approx. 1,20x1,25x,1,60 meters, year 2001
Used SMT Equipment | AOI / Automated Optical Inspection
ORBOTECH, Visual inspection machine, type TRION 2340, SN: 3800238, with 3D edge detection, included DELL PC inside and flat monitor HP, size approx. 1,20x1,25x,1,60 meters, year 2000, CE Marked
Industry News | 2010-03-22 15:12:19.0
BANNOCKBURN, Ill, USA, March 19, 2010 — In a positive sign that economic recovery is on the upswing, more than 120 new products and services from companies in the electronics manufacturing industry will debut at IPC APEX EXPO™, April 6–8, 2010, at the Mandalay Bay Resort and Convention Center in Las Vegas.
Industry News | 2011-10-28 22:56:38.0
The SMTA released a summary today of the SMTA International Conference and Exhibition which attracted more than 1,000 attendees from 25 countries. The event took place October 16-20 at the Fort Worth Convention Center in Fort Worth, Texas.
Parts & Supplies | Assembly Accessories
CM402 120 Panasonic CM402 120 Nozzle
Parts & Supplies | SMT Equipment
Panasonic CM402 120 Nozzle jenny@ksunsmt.com
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
we have many panasonic feeder for cm402/602 machines in stock as below : 8mm double lane tape feeder with sensor, part No.KXFW1KS5A00, KXFW1KSBA00 without sensor. 12/16mm/emboss tape feeder with sensor, part No.KXFW1KS6A00, KXFW1KSCA00 without sen
we have many panasonic feeder for cm402/602 machines in stock as below : 8mm double lane tape feeder with sensor, part No.KXFW1KS5A00, KXFW1KSBA00 without sensor. 12/16mm/emboss tape feeder with sensor, part No.KXFW1KS6A00, KXFW1KSCA00 without sen
Career Center | Yishun, Singapore | Maintenance
To : Sir/Madam Subject: Apply for Job Dear Sir/ Madam, I write to enquire if there is a vacancy for a SMT Maintenance Engineer in your firm.I am 40 years old a permanent resident of Singapore with an IC # S6863162i and i'm still work
SMTnet Express, April 28, 2022, Subscribers: 25,631, Companies: 11,565, Users: 27,194 The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys The different rates of thermal expansion of the many
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Panasonic Nozzles 120 SMT Nozzle KXFX0384A00 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
