Precision Casting Parts for Agricultural Tractor A. Sodium silicate sand casting. B. Steel, SST. C. Weight: Up to 7000KG. D. Pump body, impeller, etc. A. Sodium silicate sand casting. B. Steel, SST. C. Weight: Up to 7000KG. D. Pump body, impeller, e
Precision Casting Parts for Agricultural Tractor A. Sodium silicate sand casting. B. Steel, SST. C. Weight: Up to 7000KG. D. Pump body, impeller, etc. A. Sodium silicate sand casting. B. Steel, SST. C. Weight: Up to 7000KG. D. Pump body, impeller, e
Electronics Forum | Thu Jun 04 11:23:44 EDT 1998 | Frank S
If you could measure and chart 3 variables in my process, what would they be? The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure 7"
Electronics Forum | Thu Jun 04 11:57:59 EDT 1998 | Pete M
Be more specific on your problems? | If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. The
Industry News | 2017-10-05 05:41:24.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2017 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.
Industry News | 2018-07-11 20:37:51.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2018 is now available. The global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.
Technical Library | 2010-03-04 18:11:53.0
While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine pitch and area-array devices presents challenges in both printing and flux technology. With the decrease in both the size and the pitch of said components, new problems may arise, such as head-in-pillow and graping defects
Technical Library | 2018-07-18 16:28:26.0
Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented
Career Center | Gurgaon, India | Engineering,Management,Production,Purchasing,Quality Control
1. Quality Function Management • Ensure timely inspection at incoming, in-process & outgoing stage. • Non-conformance review & reporting. • Decision making - Right disposal of Non-conforming material. • Determination of Vendor Quality rating (VQR
SMTnet Express, July 19, 2018, Subscribers: 31,194, Companies: 10,991, Users: 24,953 Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith; FCT ASSEMBLY, INC. Reduction of first pass defects in the SMT assembly process
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Yue Deng1,*, Xike Zhao2
| http://etasmt.com/cc?ID=te_news_industry,26564&url=_print
: Achieve a production ready first pass yield Dynamic Production Editing means no tape boards required – no waste Simple, menu-driven process for new users Get products into production quickly, efficiently, and effectively Create and tune feeder, placement, fiducial, and component information quickly
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