Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative / Training Provider
Global OEM manufacturer of selective wave soldering machines. With a world-wide install base in over 65 countries, we are a global leader in the selective soldering space. Highly customized solutions available in all industries.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Electronics Forum | Tue Sep 10 10:17:18 EDT 2013 | gregp
Hi Reese, Thanks for the feedback. So you have a fair amount of assemblies that are new designs with 10% through hole parts. Are these parts inserted manually? What is the soldering process?...wave solder?...selective solder? Do these components
Electronics Forum | Wed Nov 19 15:48:48 EST 2014 | gregp
Thank You Adam...this is the type of input I am looking for. To summarize, you are an OEM that has gone through the process to remove most through hole parts from your assemblies. Those that remain are primarily connectors which may not require lea
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-L2 chip mounter Product number: Samsung DECN-L2 Detailed product introduction By using Vision Head 12Flying to achieve the highest speed 82000CPH Through the flight identification method, the placement of the head movin
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Parts & Supplies | SMT Equipment
MSH2 Model: PANASERT MSH2 Nozzle PANASERT Nozzle List Brand Machine Model Specification Material of nozzle tip PANASERT MV "O"hole Nozzle 1.0 / 1.2 / 1.6 / 3.0 Tungsten steel PANASERT MV No.1 Nozzle 0402X / 0603X / 0805王 Tungsten steel PANA
Parts & Supplies | SMT Equipment
MPA G3 Model: PANASERT MPA G3 Nozzle PANASERT Nozzle List Brand Machine Model Specification Material of nozzle tip PANASERT MV "O"hole Nozzle 1.0 / 1.2 / 1.6 / 3.0 Tungsten steel PANASERT MV No.1 Nozzle 0402X / 0603X / 0805王 Tungsten steel
Technical Library | 2019-06-21 10:39:15.0
Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.
Technical Library | 2020-04-14 15:49:38.0
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly.
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | North Kingstown, Rhode Island USA | Maintenance
Based in our North Kingstown, RI facility, the temporary SMT Technician will help to develop and implement Printed Circuit Board assembly process & process work instructions for SMT & Through-hole. Major Tasks and Responsibilities: Monitor & M
Career Center | Melbourne, Florida USA | Production
The SMD Repair / Operator performs all hand loading/unloading/operation of SMD line, manual soldering of Through-hole parts, inspection of PCBA's, and rework as required to support SMD production. Responsibilities: - Assists with manually load
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements/
Plated Through Hole Fill: Understanding the Process and Assembly Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Blackfox Training Institute, LLC | https://www.blackfox.com/tag/through-hole-soldering-training/
: Through Hole Soldering training You are here: Home Entries tagged with "Through Hole Soldering training" Make IPC Training Part Of Your 2021 Plan Blog , News
