Industry Directory | Equipment Dealer / Broker / Auctions
BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
Description Durostone is a fiber-reinforced plastic for mechanical and electrical applications. With good performance against electric arc and tracking, it is an ideal material for solder paste printing, SMT process, reflow soldering and wave solderi
New Equipment | Selective Soldering
PCB Soldering Pallet composite materials durostone Description Durostone is a fiber-reinforced plastic for mechanical and electrical applications. With good performance against electric arc and tracking, it is an ideal material for solder paste pri
Electronics Forum | Wed Jan 23 06:12:36 EST 2019 | tirthkar8980
Dear Team, Need help, we are trying to make urea core solder wire but the problem is some time core remains partially empty no urea filling in solder wire. please help me how to solve this problem. thank you, Tirthkar
Electronics Forum | Wed Dec 18 09:04:29 EST 2002 | russ
Dave, You stated that an unfilled via is of greater strength than a filled or partially filled via. I posted to another thread recently and I stated that a filled via was of greater strength than an unfilled. I was tought (incorrectly?) that a fill
Used SMT Equipment | Soldering - Wave
There will be (2) Speedline Vectra Elite Wave Solder systems in the online auction on behalf of Suntron. One system is leaded and the other is lead-free. Both have been maintained well. You can view photos and a partial catalog here: http://www.xli
Used SMT Equipment | Screen Printers
2003 DEK ELA Solder Paste Screen Printer in good working condition. * 110VAC and clean, dry shop air required for proper operation. L to R Board Flow * Edge Belt Conveyor * Pneumatic Edge Hold Board Clamp Conveyor * SMEMA Compliant * Visi
Industry News | 2003-06-17 08:50:16.0
The CECC-approved DIN EN60603-2 (DIN41612) Series is ideal for electronics equipment requiring reliable yet inexpensive circuit board interconnection.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Parts & Supplies | Visual Inspection
MiView USB Digital Microscope (MV200UM-PL) With Polarizer is a handheld color digital microscope with a high quality 2.0 Megapixel image sensor, adjustable high magnification from 5x to 200x, and an adjustable polarizer. This allows you to remove gl
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
Technical Library | 2020-12-10 15:49:40.0
Electronic assemblies should have longer and longer service life. Today there are partially demanded 20 years of functional capability for electronics for automotive application. On the other hand, smaller components, such as resistors of size 0201, are able to endure an increasing number of thermal cycles until fail of solder joints, so these are tested sometimes up to 4000 cycles. But testing until the end of life is essential for the determination of failure rates and the prognosis of reliability. Such tests require a lot of time, but this is often not available in developing of new modules. A further acceleration by higher cycle temperatures is usually not possible, because the materials are already operated at the upper limit of the load. However, the duration can be shortened by the use of liquids for passive tests, which allow faster temperature changes and shorter dwell times because of better heat transfer compared to air. The question is whether such tests lead to comparable results and what failure mechanisms are becoming effective. The same goes for active temperature cycles, in which the components itself are heated from inside and the substrate remains comparatively cold. This paper describes the various accelerated temperature cycling tests, compares and evaluates the related degradation of solder joints.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Career Center | Davenport, Iowa USA | Production
SURFACE MOUNT SOLDERER - COOLERS Cobham Mission Systems is seeking a Surface Mount Solderer for our Coolers Department within our Davenport, Iowa facility. This position is open due to an increase in staff. The qualified applicant will perform the
SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester
| https://pcbasupplies.com/loaders/
25 MIL Probe Shockproof Vulcan Spudgers Technician's Aids Hand Soldering & Rework TMT-2000S 2000 Series Solder Stations P Series Tips K Series Tips S Series Tips TMT-5000S 5000 Series Solder Stations T Series Tips TMT-9000S 9000 Series Solder Stations M Series Tips Hot Air
Heller Industries Inc. | https://hellerindustries.com/low-void-curing/
. Issues Caused by Voids Reduced adhesion of device to substrate Reduced thermal performance Electrical failures from “solder creep” Lower reliability & shorter lifetime Pressure Curing Removes Voids As pressure is increased, more gas molecules are able to dissolve
