Improve manufacturing operations and decision making based on real time shop-floor information Achieve goals for on-time delivery, eliminated waste, asset utilization, first pass yield, DPMO and total traceability. Valor IoT manufacturing collects
Electronics Forum | Mon Apr 26 11:04:53 EDT 1999 | Dave F
| | Earl said, in essence: | | | | | Justin is absolutely right ... | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those coatings chemi
Electronics Forum | Mon Apr 26 17:45:26 EDT 1999 | Earl Moon
| | | Earl said, in essence: | | | | | | | Justin is absolutely right ... | | | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those
Industry News | 2012-02-28 14:00:06.0
IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2021-05-25 12:56:56.0
The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
Career Center | , | 2013-03-07 05:50:27.0
Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India
SMTnet Express, Septemeber 8, 2016, Subscribers: 26,370, Companies: 14,943, Users: 41,052 How Clean is Clean Enough – At What Level Does Each of The Individual Contaminates Cause Leakage and Corrosion Failures in SIR? Terry Munson, Paco Solis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
product remains fit for use. Surface Insulation Resistance (SIR) Test defined in IPC TM-650 2.6.3.3 used to classify flux. Flux is reflowed on a set of interdigitated traces and an electrical potential is supplied. A passing test maintains a resistance
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Infrared-Preheat-Module-User-Guide-22140087.pdf
- peratureLimitHi Mfg Temp limit is 50°C 1505 OverboardTempertureOut- OfLimit The maximum reported over board tem- perature exceeds the SetPointLimitHiHi 1506 HeaterElementsNotHeating Power is applied to heaters for more than 30 seconds and the heaters' temperature
